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PIC16LF1455-I/ML

Microchip Technology

PIC16LF1455-I/ML by Microchip Technology

PIC16LF1455-I/ML by Microchip: 8-bit CPU, 1024 RAM bytes, 8192 ROM words. Ideal for industrial applications with ADC/DAC channels, PWM capabilities, and connectivity options like EUSART and USB.

Median Price

$1.400

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 90 parts In-Stock

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$1.400

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90

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Vyrian

USA . 5,270 parts In-Stock

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5,270

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Distributors (Availability)

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Continental Prestige Electronics

USA . 806 parts In-Stock

1+ parts

$1.400

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$1.372

806

$1.400

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$1.372

Argo Parts USA

USA . 652 parts In-Stock

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$1.400

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AZTECH Wire

Italy . 772 parts In-Stock

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$17.319

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772

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Semicontronic

India . 1,632 parts In-Stock

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$25.000

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$24.375

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$24.250

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1,632

$25.000

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$24.250

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Advanced Electronics

New Zealand . 1,500 parts In-Stock

1+ parts

$55.621

100+ parts

$55.065

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$52.840

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1,500

$55.621

$55.065

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QUARKTWIN TECHNOLOGY LTD

USA . 25,980 parts In-Stock

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Lixinc

USA . 19,058 parts In-Stock

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Fulton Briggs Corp.

USA . 7,971 parts In-Stock

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Microchip USA

USA . 3,629 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$1.372

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$1.330

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$1.302

500

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$1.372

$1.330

$1.302

Overview

Discover the cutting-edge technology of the PIC16LF1455-I/ML microcontroller by Microchip Technology, a leader in the industry. This versatile device offers a wide range of applications in various industries, providing customers with high-quality performance, low power consumption, and exceptional value. With advanced features such as digital to analog converters, analog to digital converters, and multiple connectivity options, this microcontroller is ideal for projects that require precision and reliability. Experience the advantages of Microchip Technology's expertise with the PIC16LF1455-I/ML microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material make the package lightweight and cost-effective, making it suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for increased performance and flexibility in powering the microcontroller.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost, suitable for many general-purpose applications.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options and flexibility in designing the system with peripherals.

ADC Channels: YES

Integrated Analog to Digital Converters enable the microcontroller to read analog signals, making it suitable for sensor interfacing and data acquisition applications.

Maximum Clock Frequency: 20 MHz

Having a high clock frequency enables faster processing speeds and real-time applications, improving overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution, leading to faster processing and lower power consumption in the microcontroller.

Connectivity: EUSART, I2C, MSSP, SPI, USB

Multiple connectivity options allow for easy communication with other devices and peripherals, enhancing the versatility of the microcontroller in various applications.

Technical Specifications

Microcontrollers PIC16LF1455-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

1

No. of I/O Lines:

11

No. of Serial I/Os:

1

No. of Terminals:

16

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Current:

292 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSART, I2C, MSSP, SPI, USB

Peripherals:

BOR, COMPARATOR(2), POR, PWM(2), TIMER(4), WDT

Analog To Digital Convertors:

5-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16LF1455-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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