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PIC16LC770-E/SO

Microchip Technology

PIC16LC770-E/SO by Microchip Technology

PIC16LC770-E/SO by Microchip: 8-bit CPU, 256B RAM, 2048 ROM words. Ideal for automotive applications with -40 to 125 °C operating temp range. Features include 6-Ch ADC, I2C/SPI connectivity, and PWM/TIMER peripherals.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,937 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 655 parts In-Stock

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Ampacity Inc.

Singapore . 341 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Microchip USA

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West Coast Incorporated

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Aranea Global

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Overview

Experience the power of innovation with the PIC16LC770-E/SO microcontroller by Microchip Technology. Known for their superior quality and cutting-edge technology, Microchip offers a wide range of applications in the realm of microcontrollers. This product provides unmatched value, benefits, and advantages to customers seeking reliable performance in their electronic devices. From automotive to industrial applications, the PIC16LC770-E/SO delivers optimal solutions for all your microcontroller needs, ensuring seamless integration and top-notch functionality. Trust Microchip Technology to take your projects to the next level with the PIC16LC770-E/SO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and making the product more compact.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, making it versatile for different applications.

Package Shape: RECTANGULAR

Standard package shape that is easy to work with during assembly.

Bit Size: 8

Suitable for simpler applications that do not require a higher bit size.

Power Supplies (V): 3/5

Compatible with common power supply voltages, making it easy to integrate into existing systems.

No. of Terminals: 18

Provides enough connectivity options for various input and output needs.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the PCB and allows for more components to be added.

Minimum Supply Voltage: 2.5 V

Can operate at low supply voltages, ideal for energy-efficient applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for automotive and industrial environments.

CPU Family: PIC

Well-known and reliable CPU family for microcontrollers.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures, making it suitable for a wide range of environments.

Terminal Finish: Matte Tin (Sn)

Provides a reliable connection and corrosion resistance.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and inputs.

Terminal Position: DUAL

Offers flexibility in mounting orientation for ease of integration.

ROM Words: 2048

Sufficient memory for storing program instructions and data.

Maximum Seated Height: 4.32 mm

Low profile design for compact applications.

Width: 7.62 mm

Narrow width saves space on the PCB.

Peripherals: BOD, POR, PWM, TIMER(3), WDT

Features a variety of peripherals for enhanced functionality.

Maximum Clock Frequency: 20 MHz

High clock frequency allows for fast processing and response times.

Length: 22.8 mm

Optimal length for fitting into compact designs.

Temperature Grade: AUTOMOTIVE

Designed to operate reliably in automotive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing.

RAM Bytes: 256

Sufficient RAM for temporary data storage during program execution.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Ease of soldering during assembly.

Analog To Digital Convertors: 6-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion.

Maximum Supply Current: 3 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with a wide range of systems.

PWM Channels: YES

Pulse-width modulation channels for precise control of output signals.

Connectivity: I2C, SPI

Supports popular communication interfaces for seamless integration with other devices.

ROM Programmability: OTPROM

One-time programmable ROM for secure and reliable program storage.

Terminal Pitch: 2.54 mm

Standard pitch for easy integration into the PCB layout.

Speed: 20 rpm

Fast processing speed for real-time applications.

On Chip Program ROM Width: 14

Sufficient width for storing program instructions.

No. of I/O Lines: 16

Plenty of input/output lines for connecting to external devices and sensors.

Technical Specifications

Microcontrollers PIC16LC770-E/SO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

PIC

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

22.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

16

No. of Terminals:

18

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

OTPROM

Maximum Seated Height:

4.32 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

BOD, POR, PWM, TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

PIC16LC770-E/SO Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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