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PIC16F1939-E/ML

Microchip Technology

PIC16F1939-E/ML by Microchip Technology

PIC16F1939-E/ML by Microchip: 8-bit RISC microcontroller with 16384 ROM words, 256 bytes EEPROM, and 1024 RAM bytes. Ideal for automotive applications due to its wide temperature range (-40 to 125 °C) and low power mode. Features include 14-Ch ADC, 1-Ch DAC, and connectivity options like EUSART, I2C, SPI.

Median Price

$3.320

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 3,825 parts In-Stock

1+ parts

$3.320

100+ parts

$2.760

1k+ parts

$2.530

10k+ parts

$2.420

3,825

$3.320

$2.760

$2.530

$2.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 25 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

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25

$3.160

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Vyrian

USA . 1,904 parts In-Stock

1+ parts

-

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1,904

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$3.097

100+ parts

-

1k+ parts

$2.973

10k+ parts

-

500

$3.097

-

$2.973

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Continental Prestige Electronics

USA . 2,694 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

$3.097

2,694

$3.160

-

-

$3.097

Argo Parts USA

USA . 507 parts In-Stock

1+ parts

$3.160

100+ parts

-

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507

$3.160

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Ampacity Inc.

Singapore . 164 parts In-Stock

1+ parts

$6.000

100+ parts

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164

$6.000

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AZTECH Wire

Italy . 774 parts In-Stock

1+ parts

$16.753

100+ parts

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774

$16.753

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Lixinc

USA . 16,021 parts In-Stock

1+ parts

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16,021

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RGB Technical Solutions

Ukraine . 697 parts In-Stock

1+ parts

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697

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Overview

Unlock endless possibilities with the Microchip Technology PIC16F1939-E/ML microcontroller. With its top-notch quality and reliability, this product is ideal for a wide range of applications in the automotive industry, consumer electronics, and more. Experience the value and benefits that come with this powerful microcontroller, providing you with enhanced performance, connectivity options, and low power mode for energy efficiency. Trust in Microchip Technology to deliver cutting-edge solutions tailored to your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microcontroller suitable for various applications while ensuring longevity.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

ADC Channels: YES

The presence of analog to digital converters enables the microcontroller to interface with sensors and other analog devices, expanding its functionality.

ROM Words: 16384

The large ROM capacity allows for storing complex program codes, making the microcontroller suitable for applications that require extensive programming.

Connectivity: EUSART, I2C, SPI

Multiple connectivity options make it easy to communicate and interface with other devices, enhancing the versatility of the microcontroller.

Speed: 32 rpm

The high speed capability of 32 MHz allows for rapid data processing, making the microcontroller efficient for tasks that require quick response times.

Low Power Mode: YES

The low power mode feature helps conserve energy, prolonging battery life in portable devices and reducing overall power consumption.

Technical Specifications

Microcontrollers PIC16F1939-E/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

1

No. of I/O Lines:

36

No. of Serial I/Os:

1

No. of Terminals:

44

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

EUSART, I2C, SPI

Peripherals:

BOR, COMPARATOR(2), POR, TIMER(8), WDT

Analog To Digital Convertors:

14-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F1939-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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