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PIC16F18325T-E/7NVAO

Microchip Technology

PIC16F18325T-E/7NVAO by Microchip Technology

PIC16F18325T-E/7NVAO by Microchip: 8-bit RISC microcontroller with 32 MHz clock, 11-Ch 10-Bit ADC, and 1-Ch 5-Bit DAC. Ideal for automotive applications due to AEC-Q100 screening, -40 to 125 °C operating temp range, and low power mode. Offers extensive peripherals like BOR, CCP(4), CLC(4), PWM(2), I2C(2), SPI(2) for versatile connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,617 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Semicontronic

India . 271 parts In-Stock

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$3.000

100+ parts

$2.925

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$2.910

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271

$3.000

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$2.910

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AZTECH Wire

Italy . 799 parts In-Stock

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$13.745

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Ampacity Inc.

Singapore . 1,456 parts In-Stock

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$26.000

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Corohmni

South Africa . 73 parts In-Stock

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$31.057

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73

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$45.194

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$42.935

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$42.935

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500

$45.194

$42.935

$42.935

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Aztec Data Supply Inc.

USA . 1,243 parts In-Stock

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$75.360

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$75.360

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Fulton Briggs Corp.

USA . 3,937 parts In-Stock

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Continental Prestige Electronics

USA . 2,702 parts In-Stock

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Argo Parts USA

USA . 2,112 parts In-Stock

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Microchip USA

USA . 1,472 parts In-Stock

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Bastille Electronics

Australia . 750 parts In-Stock

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Overview

Elevate your projects with the PIC16F18325T-E/7NVAO microcontroller from Microchip Technology. Designed to deliver superior performance, this versatile device offers a wide range of applications in various industries. With its high-quality manufacturing standards and cutting-edge technology, this microcontroller guarantees reliable operation and seamless integration. Experience the value of innovation with the PIC16F18325T-E/7NVAO and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

Allows for a wide voltage range operation, providing flexibility in power supply options.

Bit Size: 8

8-bit architecture allows for efficient processing of data and commands.

ADC Channels: YES

Features Analog to Digital Converters, enabling the microcontroller to interface with analog sensors and signals.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications, meeting stringent requirements for temperature and reliability.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity.

Maximum Clock Frequency: 32 MHz

Provides high processing speed for quick response times in applications.

Connectivity: I2C(2), SPI(2), EUSART

Multiple communication interfaces allow for seamless connectivity with other devices and systems.

Technical Specifications

Microcontrollers PIC16F18325T-E/7NVAO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.3 V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Low Power Mode:

YES

No. of I/O Lines:

12

No. of Serial I/Os:

1

No. of Terminals:

16

No. of Timers:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Current:

3.1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Connectivity:

I2C(2), SPI(2), EUSART

Peripherals:

BOR, CCP(4), COMPARATOR(2), CLC(4), FVR, POR, PWM(2), TIMER(8), WDT

Analog To Digital Convertors:

11-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F18325T-E/7NVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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