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PIC16F18323T-I/SLVAO

Microchip Technology

PIC16F18323T-I/SLVAO by Microchip Technology

PIC16F18323T-I/SLVAO by Microchip: 8-bit RISC microcontroller with 256B RAM, 2048 ROM words. Ideal for industrial applications, featuring 11-Ch ADC, 1-Ch DAC, and peripherals like BOR, PWM(2), USART. Operates at -40 to +85°C with low power mode and supports I2C/SPI connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,670 parts In-Stock

1+ parts

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7,670

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 148 parts In-Stock

1+ parts

$2.000

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148

$2.000

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Semicontronic

India . 878 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

10k+ parts

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878

$9.000

$8.775

$8.730

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AZTECH Wire

Italy . 519 parts In-Stock

1+ parts

$14.634

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519

$14.634

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Continental Prestige Electronics

USA . 4,483 parts In-Stock

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4,483

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Argo Parts USA

USA . 4,113 parts In-Stock

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4,113

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Fulton Briggs Corp.

USA . 3,636 parts In-Stock

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3,636

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Microchip USA

USA . 1,789 parts In-Stock

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1,789

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the cutting-edge PIC16F18323T-I/SLVAO microcontroller by Microchip Technology, known for its exceptional quality and reliability. This versatile device is perfect for a wide range of applications in industries such as automotive, consumer electronics, and industrial automation. With features like low power mode, 32 MHz maximum clock frequency, and 11-channel 10-bit ADC, this microcontroller offers unmatched value and performance to customers looking to streamline their projects and enhance efficiency. Upgrade your designs with the PIC16F18323T-I/SLVAO and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this microcontroller lightweight and cost-effective.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and effort in production.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V provides flexibility in power supply options for the microcontroller.

On Chip Data RAM Width: 8

The wide on-chip data RAM of width 8 allows for efficient data processing and storage within the microcontroller.

No. of Terminals: 14

With 14 terminals, this microcontroller offers versatile connectivity options for external components and peripherals.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels enables the microcontroller to process analog signals, making it suitable for a variety of sensor applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computing (RISC) architecture, this product offers efficient and streamlined performance for embedded applications.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency of 32 MHz allows for fast processing speeds, making this microcontroller suitable for applications requiring quick response times.

Connectivity: I2C, SPI, USART

Support for communication protocols like I2C, SPI, and USART enhances the versatility and compatibility of this microcontroller with various external devices and subsystems.

Technical Specifications

Microcontrollers PIC16F18323T-I/SLVAO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

2.3 V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

1

No. of I/O Lines:

12

No. of Serial I/Os:

1

No. of Terminals:

14

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

RAM Bytes:

256

RAM Words:

256

ROM Words:

2048

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.75 mm

Speed:

32 rpm

Maximum Supply Current:

2.6 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), CLC, CWG, POR, PWM(2), TIMER(3), WDT

Analog To Digital Convertors:

11-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F18323T-I/SLVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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