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PIC16F18323-I/SLVAO

Microchip Technology

PIC16F18323-I/SLVAO by Microchip Technology

PIC16F18323-I/SLVAO by Microchip Technology is an 8-bit microcontroller with 2048 ROM words and 256 RAM bytes. It features 11-Ch 10-Bit ADC channels, 1-Ch 5-Bit DAC channels, and peripherals like BOR, CLC, PWM(2), and USART for industrial applications requiring low power mode and connectivity via I2C, SPI.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,452 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 363 parts In-Stock

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$6.027

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363

$6.027

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Aztec Data Supply Inc.

USA . 321 parts In-Stock

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$28.800

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Ampacity Inc.

Singapore . 172 parts In-Stock

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$30.000

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Corohmni

South Africa . 516 parts In-Stock

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$45.346

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516

$45.346

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Continental Prestige Electronics

USA . 6,684 parts In-Stock

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XL Components Corporation

Australia . 5,707 parts In-Stock

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Argo Parts USA

USA . 4,650 parts In-Stock

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QualityLine Systems

Poland . 4,590 parts In-Stock

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Microchip USA

USA . 2,083 parts In-Stock

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Marpe Global Electronics

Taiwan . 1,197 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience the pinnacle of innovation with the Microchip PIC16F18323-I/SLVAO microcontroller. Crafted by Microchip Technology, a leader in semiconductor manufacturing, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller boasts advanced features such as DAC and ADC channels, PWM capabilities, and low power mode, making it a versatile solution for your project needs. Trust in the quality and expertise of Microchip Technology to deliver cutting-edge technology that exceeds expectations. Elevate your designs with the PIC16F18323-I/SLVAO, where value meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options while operating the microcontroller.

ADC Channels: YES

Ability to convert analog signals into digital data, making it suitable for a wide range of applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of software, enhancing versatility and ease of use.

Connectivity: I2C, SPI, USART

Multiple communication interfaces enable seamless integration with other devices and systems.

Speed: 32 rpm

High speed operation allows for quick processing of tasks, making it suitable for real-time applications.

Low Power Mode: YES

Efficient power management features help in reducing overall power consumption, making it energy-efficient.

Technical Specifications

Microcontrollers PIC16F18323-I/SLVAO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

2.3 V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

1

No. of I/O Lines:

12

No. of Serial I/Os:

1

No. of Terminals:

14

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

RAM Bytes:

256

RAM Words:

256

ROM Words:

2048

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.75 mm

Speed:

32 rpm

Maximum Supply Current:

2.6 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), CLC, CWG, POR, PWM(2), TIMER(3), WDT

Analog To Digital Convertors:

11-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F18323-I/SLVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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