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PIC16F1707-E/ML

Microchip Technology

PIC16F1707-E/ML by Microchip Technology

PIC16F1707-E/ML by Microchip: 8-bit RISC microcontroller with 2048 ROM words, 256 bytes RAM, and 12-Ch 10-Bit ADC. Ideal for automotive applications due to its low power mode, PWM channels, and connectivity options like I2C and SPI. Operating temperature range from -40 to 125 °C.

Median Price

$0.665

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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RS (Exports)

UK . 69 parts In-Stock

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$0.390

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RS Americas

USA . 69 parts In-Stock

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$0.940

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Vyrian

USA . 4,601 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Ampacity Inc.

Singapore . 69 parts In-Stock

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$0.800

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Semicontronic

India . 69 parts In-Stock

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$0.800

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$0.780

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$0.776

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Corohmni

South Africa . 1,044 parts In-Stock

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$1.424

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Component Stockers USA

USA . 95 parts In-Stock

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$1.520

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Allen Electronics Distributors

USA . 69 parts In-Stock

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$2.490

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$1.830

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AZTECH Wire

Italy . 994 parts In-Stock

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$19.510

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QualityLine Systems

Poland . 6,570 parts In-Stock

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Marpe Global Electronics

Taiwan . 6,206 parts In-Stock

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XL Components Corporation

Australia . 4,751 parts In-Stock

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Argo Parts USA

USA . 3,084 parts In-Stock

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Continental Prestige Electronics

USA . 1,973 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Overview

Discover the power and versatility of the PIC16F1707-E/ML microcontroller by Microchip Technology. Designed with top-notch quality and cutting-edge technology, this device is perfect for a wide range of applications in the automotive industry and beyond. With its low power mode and PWM channels, customers can enjoy efficient performance and precise control. Take your projects to the next level with the reliable and innovative features of the PIC16F1707-E/ML, providing value and benefits that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and resistance to heat, making the product long-lasting and reliable.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows for flexibility in power requirements and compatibility with a wider range of components.

ADC Channels: YES

Having Analog to Digital Converters built-in allows for easy interfacing with analog sensors and signals, enhancing the product's versatility.

ROM Programmability: FLASH

Flash programmable ROM provides flexibility for firmware updates and modifications without the need for external programmers, adding convenience for users.

Connectivity: I2C, SPI

Support for popular communication protocols like I2C and SPI enables seamless integration with other devices, expanding the product's connectivity options.

Technical Specifications

Microcontrollers PIC16F1707-E/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 16MHZ AT 2.3V MIN SUPPLY

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of I/O Lines:

18

No. of Terminals:

20

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

I2C, SPI

Peripherals:

BOD, POR, TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

PIC16F1707-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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