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PIC16F1705-E/ML

Microchip Technology

PIC16F1705-E/ML by Microchip Technology

PIC16F1705-E/ML by Microchip: 8-bit RISC microcontroller with 8192 ROM words, 128 bytes EEPROM, and 1024 RAM bytes. Ideal for automotive applications due to -40 to 125 °C operating temp range, low power mode, and connectivity options like EUSART, I2C, SPI.

Median Price

$1.510

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 582 parts In-Stock

1+ parts

$1.510

100+ parts

$1.250

1k+ parts

-

10k+ parts

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582

$1.510

$1.250

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 42 parts In-Stock

1+ parts

$1.361

100+ parts

-

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42

$1.361

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Vyrian

USA . 4,312 parts In-Stock

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4,312

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Distributors (Availability)

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Ampacity Inc.

Singapore . 263 parts In-Stock

1+ parts

$1.280

100+ parts

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263

$1.280

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Continental Prestige Electronics

USA . 5,029 parts In-Stock

1+ parts

$1.361

100+ parts

-

1k+ parts

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10k+ parts

$1.334

5,029

$1.361

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$1.334

Argo Parts USA

USA . 4,124 parts In-Stock

1+ parts

$1.361

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-

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4,124

$1.361

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Semicontronic

India . 619 parts In-Stock

1+ parts

$2.790

100+ parts

$2.720

1k+ parts

$2.706

10k+ parts

-

619

$2.790

$2.720

$2.706

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AZTECH Wire

Italy . 291 parts In-Stock

1+ parts

$14.783

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291

$14.783

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Lixinc

USA . 19,618 parts In-Stock

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19,618

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West Coast Incorporated

USA . 2,983 parts In-Stock

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2,983

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Overview

Discover the innovative PIC16F1705-E/ML microcontroller by Microchip Technology, a top-tier manufacturer known for high-quality products. This versatile chip is ideal for a wide range of applications in the automotive industry, offering exceptional value with its low power consumption and high performance. With features like built-in DAC and ADC channels, multiple peripherals, and flash ROM programmability, this microcontroller delivers impressive capabilities for your projects. Trust Microchip Technology to provide reliable solutions that drive your designs forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability to the product.

Maximum Supply Voltage: 5.5 V

Can operate at higher voltages, making it suitable for a variety of applications.

ADC Channels: YES

Ability to convert analog signals to digital, expanding the range of inputs the microcontroller can accept.

ROM Words: 8192

Large ROM capacity allows for storing more program instructions and data.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast execution of instructions, improving overall performance.

Connectivity: EUSART, I2C, SPI

Support for various communication protocols allows for easy integration with other devices.

Technical Specifications

Microcontrollers PIC16F1705-E/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.3 V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

1

No. of I/O Lines:

12

No. of Serial I/Os:

1

No. of Terminals:

16

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

EUSART, I2C, SPI

Peripherals:

BOR, COMPARATOR(2), POR, PWM(2), TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

PIC16F1705-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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