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PIC16F15325T-E/SLVAO

Microchip Technology

PIC16F15325T-E/SLVAO by Microchip Technology

PIC16F15325T-E/SLVAO by Microchip: 32MHz max clock, 3V nominal voltage, 1024 bytes RAM. Ideal for automotive applications with AEC-Q100 screening, featuring 11-Ch ADC, 1-Ch DAC, and peripherals like PWM and RTC.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,246 parts In-Stock

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Nova Conductors

Japan . 36 parts In-Stock

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36

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Distributors (Availability)

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AZTECH Wire

Italy . 147 parts In-Stock

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$18.000

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147

$18.000

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Ampacity Inc.

Singapore . 694 parts In-Stock

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$25.000

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694

$25.000

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Corohmni

South Africa . 587 parts In-Stock

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$28.021

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587

$28.021

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QUARKTWIN TECHNOLOGY LTD

USA . 21,240 parts In-Stock

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West Coast Incorporated

USA . 5,250 parts In-Stock

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5,250

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Microchip USA

USA . 4,654 parts In-Stock

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4,654

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Netroflash

USA . 50 parts In-Stock

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Overview

Unleash the power of innovation with the Microchip Technology PIC16F15325T-E/SLVAO microcontroller. Designed with the highest quality standards, this versatile component is perfect for a wide range of applications in automotive and industrial settings. With its advanced features and cutting-edge technology, customers can expect superior performance and reliability. Experience the value and benefits that only Microchip Technology can deliver, and take your projects to the next level with the PIC16F15325T-E/SLVAO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the microcontroller, ensuring reliable performance in various environments.

ADC Channels: YES

With 11 analog to digital converter channels, this microcontroller can efficiently convert analog signals to digital data for accurate processing and control.

DAC Channels: YES

The digital to analog converter channel allows the microcontroller to output analog signals based on digital input, enabling it to interact with analog components in a system.

ROM Programmability: FLASH

Flash ROM allows for reprogrammability of the microcontroller, enabling firmware updates and customization without needing to replace the entire chip.

Maximum Clock Frequency: 32 MHz

With a high maximum clock frequency, this microcontroller can perform operations at a faster rate, making it suitable for applications that require quick processing.

Low Power Mode: YES

The low power mode feature helps to conserve energy when the microcontroller is not in active use, making it efficient for battery-powered devices or applications where power consumption is a concern.

Technical Specifications

Microcontrollers PIC16F15325T-E/SLVAO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 2.3V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

1

No. of I/O Lines:

12

No. of Serial I/Os:

2

No. of Terminals:

14

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.75 mm

Speed:

32 rpm

Maximum Supply Current:

3.6 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Data EEPROM Size:

224

Connectivity:

EUSART(2), I2C

Peripherals:

BOD, BOR, COMPARATOR(2), POR, PWM(4), RTC, TIMER(3), WDT

Analog To Digital Convertors:

11-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F15325T-E/SLVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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