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PIC16F1509-E/P

Microchip Technology

PIC16F1509-E/P by Microchip Technology

PIC16F1509-E/P by Microchip: 8-bit CPU, 20 MHz clock, 12-Ch ADC, 1-Ch DAC. Ideal for automotive applications with peripherals like PWM, USART, and SPI. Operating temperature range from -40 to 125 °C.

Median Price

$2.140

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 702 parts In-Stock

1+ parts

$2.140

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$1.760

1k+ parts

$1.630

10k+ parts

$1.540

702

$2.140

$1.760

$1.630

$1.540

DigiKey

USA . 328 parts In-Stock

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$2.140

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$1.760

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328

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$1.760

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Mouser Electronics

USA . 309 parts In-Stock

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$2.140

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$1.950

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$1.760

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309

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$1.950

$1.760

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Distributors (In-Stock)

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Nova Conductors

Japan . 38 parts In-Stock

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$1.936

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38

$1.936

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NAC Semi

USA . 572 parts In-Stock

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$2.320

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$2.100

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$1.890

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572

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$1.890

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Vyrian

USA . 5,590 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 9 parts In-Stock

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Ampacity Inc.

Singapore . 181 parts In-Stock

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$1.820

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181

$1.820

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Semicontronic

India . 142 parts In-Stock

1+ parts

$1.820

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$1.774

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$1.765

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142

$1.820

$1.774

$1.765

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Aranea Global

USA . 50 parts In-Stock

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$1.897

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$1.821

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50

$1.897

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$1.821

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Continental Prestige Electronics

USA . 4,897 parts In-Stock

1+ parts

$1.936

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$1.897

4,897

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$1.897

Argo Parts USA

USA . 2,508 parts In-Stock

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$1.936

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AZTECH Wire

Italy . 395 parts In-Stock

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$6.547

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Perfect Parts

USA . 347 parts In-Stock

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West Coast Incorporated

USA . 70 parts In-Stock

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70

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Overview

Discover the power and precision of the Microchip Technology PIC16F1509-E/P microcontroller! Designed with cutting-edge technology and a dedication to quality, this versatile device offers a wide range of applications in various industries. With features like DAC channels, ADC channels, PWM channels, and connectivity options such as I2C, SPI, and USART, this microcontroller provides unmatched value and performance for your projects. Experience seamless operation and reliable functionality with the PIC16F1509-E/P - unlocking endless possibilities for innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, ensuring compatibility with various systems.

Bit Size: 8

The 8-bit architecture provides a good balance between performance and cost, making it suitable for a wide range of applications.

Power Supplies: 2.5/5 V

The dual power supply options of 2.5V and 5V offer versatility in voltage requirements, enabling compatibility with different components in a system.

ADC Channels: YES

The availability of Analog-to-Digital Converter (ADC) channels allows for the conversion of analog signals to digital data, essential for many applications such as sensor interfacing.

ROM Words: 8192

The 8192 ROM words provide ample storage capacity for program code, data storage, and firmware updates, ensuring versatility in program design.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with a Reduced Instruction Set Computing (RISC) architecture offers high performance, low power consumption, and efficient code execution, making it suitable for various embedded applications.

Speed: 20 rpm

The operating speed of 20 rpm allows for fast data processing and response times, ensuring efficient performance in real-time applications.

Technical Specifications

Microcontrollers PIC16F1509-E/P attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.3 V MINIMUM SUPPLY AT 16 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

PIC

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.162 mm

No. of I/O Lines:

18

No. of Terminals:

20

On Chip Program ROM Width:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

5.334 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.4 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

BOD, COMPARATOR(2), POR, PWM(4), TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F1509-E/P Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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