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PIC16F1459T-I/ML

Microchip Technology

PIC16F1459T-I/ML by Microchip Technology

PIC16F1459T-I/ML by Microchip: 8-bit CPU, 5.5V max supply, 20MHz clock freq. Ideal for industrial applications with ADC/DAC channels, USB connectivity, and low power mode.

Median Price

$1.815

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 73 parts In-Stock

1+ parts

$1.815

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73

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Vyrian

USA . 3,694 parts In-Stock

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3,694

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,612 parts In-Stock

1+ parts

$1.815

100+ parts

-

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$1.779

4,612

$1.815

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$1.779

Argo Parts USA

USA . 3,543 parts In-Stock

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$1.815

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Ampacity Inc.

Singapore . 3,175 parts In-Stock

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$1.900

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$1.900

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Semicontronic

India . 3,006 parts In-Stock

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$1.900

100+ parts

$1.852

1k+ parts

$1.843

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3,006

$1.900

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$1.843

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AZTECH Wire

Italy . 924 parts In-Stock

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$12.790

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924

$12.790

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Corohmni

South Africa . 359 parts In-Stock

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$27.022

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359

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Aztec Data Supply Inc.

USA . 4,307 parts In-Stock

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$28.930

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RC Electronics

USA . 40,175 parts In-Stock

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Fulton Briggs Corp.

USA . 5,398 parts In-Stock

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Lixinc

USA . 4,805 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the PIC16F1459T-I/ML microcontroller from Microchip Technology. Designed for maximum efficiency and performance, this versatile device offers a wide range of applications in various industries. With its advanced features and high-quality construction, customers can expect seamless integration and reliable operation. Experience the value and benefits of next-level innovation with the PIC16F1459T-I/ML, setting new standards in microcontroller technology. Elevate your projects to new heights with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and offers good protection, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 5.5 V

Supports a higher supply voltage range, providing flexibility for different power requirements.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient data processing and storage capabilities.

Package Shape: SQUARE

Square package shape allows for easy integration into compact electronic devices.

Bit Size: 8

8-bit architecture offers a good balance between performance and cost for many applications.

ADC Channels: YES

Integrated ADC channels enable analog sensor interfacing and data conversion for accurate measurements.

ROM Words: 8192

Large ROM capacity allows for storing a significant amount of program code and data.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the product to function reliably in harsh environments.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding industrial applications.

Analog To Digital Convertors: 9-Ch 10-Bit

Multiple ADC channels with 10-bit resolution provide precise analog signal conversion for accurate measurements.

Connectivity: EUSART, I2C, MSSP, SPI, USB

Support for multiple communication interfaces allows for seamless connectivity with other devices.

Technical Specifications

Microcontrollers PIC16F1459T-I/ML attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC16

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of I/O Lines:

17

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

1024

RAM Words:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Current:

292 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSART, I2C, MSSP, SPI, USB

Peripherals:

BOR, COMPARATOR(2), POR, PWM(2), TIMER(4), WDT

Analog To Digital Convertors:

9-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 5-Bit

Trade Compliance

PIC16F1459T-I/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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