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PIC10F222T-I/MC

Microchip Technology

PIC10F222T-I/MC by Microchip Technology

PIC10F222T-I/MC by Microchip Technology is an 8-bit microcontroller with 512 ROM words, 23 RAM bytes, and 2 ADC channels. It operates at a max clock frequency of 8 MHz and has low power mode capabilities. Ideal for industrial applications requiring a compact design and low power consumption.

Median Price

$1.105

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.105

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.105

-

-

-

Vyrian

USA . 4,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,729

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,315 parts In-Stock

1+ parts

$1.105

100+ parts

-

1k+ parts

-

10k+ parts

$1.083

6,315

$1.105

-

-

$1.083

Argo Parts USA

USA . 3,216 parts In-Stock

1+ parts

$1.105

100+ parts

-

1k+ parts

-

10k+ parts

-

3,216

$1.105

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.105

100+ parts

-

1k+ parts

$1.050

10k+ parts

$1.028

1,000

$1.105

-

$1.050

$1.028

Ampacity Inc.

Singapore . 1,473 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,473

$2.000

-

-

-

AZTECH Wire

Italy . 485 parts In-Stock

1+ parts

$7.781

100+ parts

-

1k+ parts

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10k+ parts

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485

$7.781

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-

-

Lixinc

USA . 7,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,256

-

-

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West Coast Incorporated

USA . 1,768 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,768

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-

Overview

Unlock endless possibilities with the Microchip Technology PIC10F222T-I/MC microcontroller, designed to deliver top-notch performance and reliability. Manufactured by the industry leader Microchip Technology, this versatile device is perfect for a wide range of applications. With its low power mode, fixed point format, and flash ROM programmability, this microcontroller offers unparalleled value and benefits to customers looking for cutting-edge technology. Whether you're working on automotive electronics, consumer appliances, or IoT devices, the PIC10F222T-I/MC is the ideal solution for all your project needs. Elevate your designs with Microchip Technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the product can handle a wide range of power inputs, providing flexibility in application.

On Chip Data RAM Width: 8

Having a wider data RAM allows for faster processing and storage of data, improving overall performance.

Screening Level: TS 16949

This screening level ensures high quality and reliability of the product, making it suitable for critical applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, making the product ideal for compact designs.

Bit Size: 8

An 8-bit architecture enables efficient processing of data in small chunks, making the product suitable for low to mid-level complexity tasks.

Power Supplies (V): 2.5/5

Supporting multiple power supply voltages allows for compatibility with a variety of systems, offering versatility in application.

Technical Specifications

Microcontrollers PIC10F222T-I/MC attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

4

No. of Terminals:

8

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

23

ROM Words:

512

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

1.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

POR, TIMER, WDT

Analog To Digital Convertors:

2-Ch 8-Bit

Trade Compliance

PIC10F222T-I/MC Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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