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PIC10F222-E/OT

Microchip Technology

PIC10F222-E/OT by Microchip Technology

PIC10F222-E/OT by Microchip: 8-bit, 512 ROM words, 2-Ch 8-Bit ADC. Ideal for automotive applications with low power mode, POR, TIMER, WDT peripherals. Operates at -40 to 125 °C with max clock freq of 8 MHz.

Median Price

$0.890

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 12,974 parts In-Stock

1+ parts

$0.890

100+ parts

$0.780

1k+ parts

$0.710

10k+ parts

$0.690

12,974

$0.890

$0.780

$0.710

$0.690

Distributors (In-Stock)

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Vyrian

USA . 4,303 parts In-Stock

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4,303

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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Ampacity Inc.

Singapore . 13,266 parts In-Stock

1+ parts

$1.650

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$1.650

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AZTECH Wire

Italy . 1,023 parts In-Stock

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$8.510

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$8.510

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Corohmni

South Africa . 802 parts In-Stock

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$69.834

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802

$69.834

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Montano Global Distributors

Canada . 7,543 parts In-Stock

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LMD Electronica

Estonia . 6,399 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,001 parts In-Stock

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5,001

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LOOK Integrated Logistics

Peru . 2,642 parts In-Stock

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NIA Electronics

USA . 1,619 parts In-Stock

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Ledger Components

France . 1,619 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Microchip USA

USA . 257 parts In-Stock

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Overview

Looking for a reliable microcontroller for your project? Look no further than the Microchip Technology PIC10F222-E/OT. With its high-quality construction and top-notch manufacturer, this microcontroller offers unmatched performance and versatility. Whether you're working on automotive applications or IoT devices, this product has you covered. Say goodbye to technical headaches and hello to seamless integration with the PIC10F222-E/OT. Upgrade your project today and experience the benefits firsthand!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.5 V

Offers a wide range of operating voltages, making it versatile for different applications.

On Chip Data RAM Width: 8

Sufficient on-chip RAM for data storage and processing, improving overall system performance.

Screening Level: TS 16949

Compliance with TS 16949 quality standards ensures reliability and quality in automotive applications.

Package Shape: RECTANGULAR

Standard package shape for easy integration into PCB designs.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost for many applications.

Power Supplies (V): 2.5/5

Supports multiple power supply options, allowing for flexibility in design and compatibility with different systems.

No. of Terminals: 6

Simplifies the PCB layout and reduces overall system complexity.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and allows for high-density designs.

Technical Specifications

Microcontrollers PIC10F222-E/OT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

PIC10

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

4

No. of Terminals:

6

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

23

ROM Words:

512

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.45 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

1.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

POR, TIMER, WDT

Analog To Digital Convertors:

2-Ch 8-Bit

Trade Compliance

PIC10F222-E/OT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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