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PAC1951T-1E/J6CX

Microchip Technology

PAC1951T-1E/J6CX by Microchip Technology

PAC1951T-1E/J6CX by Microchip: Power Management IC with 16 terminals, Vsup range of 2.7V to 5.5V, and adjustable threshold. Ideal for power supply support circuits in applications requiring a nominal Vsup of 3.3V, operating b/w -40°C to 125°C in surface-mount designs.

Median Price

$1.160

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9,684 parts In-Stock

1+ parts

$1.160

100+ parts

$0.938

1k+ parts

-

10k+ parts

$0.937

9,684

$1.160

$0.938

-

$0.937

Microchip Technology

USA . 1,466 parts In-Stock

1+ parts

$1.160

100+ parts

$0.880

1k+ parts

$0.850

10k+ parts

$0.840

1,466

$1.160

$0.880

$0.850

$0.840

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$1.100

100+ parts

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1,000

$1.100

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Vyrian

USA . 11,368 parts In-Stock

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11,368

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Distributors (Availability)

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Netroflash

USA . 50 parts In-Stock

1+ parts

$1.100

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50

$1.100

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Ampacity Inc.

Singapore . 11,469 parts In-Stock

1+ parts

$1.840

100+ parts

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11,469

$1.840

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Microchip USA

USA . 7,708 parts In-Stock

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$7.150

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7,708

$7.150

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QUARKTWIN TECHNOLOGY LTD

USA . 12,891 parts In-Stock

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NIA Electronics

USA . 8,177 parts In-Stock

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Ledger Components

France . 8,177 parts In-Stock

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Montano Global Distributors

Canada . 8,066 parts In-Stock

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8,066

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LOOK Integrated Logistics

Peru . 5,402 parts In-Stock

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LMD Electronica

Estonia . 4,305 parts In-Stock

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Overview

Elevate your power management game with the PAC1951T-1E/J6CX by industry leader Microchip Technology. Designed for maximum efficiency, this Rectangular Power Management IC offers unparalleled reliability and performance. Ideal for a wide range of applications, its cutting-edge technology ensures optimal power supply support without compromising on quality. Say goodbye to unreliable power sources and hello to seamless operations with the PAC1951T-1E/J6CX. Upgrade your systems today and experience the difference.

Feature Benefit Bullets

Surface Mount: YES

This product is easy to mount on circuit boards, making it convenient for manufacturers.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board.

Nominal Supply Voltage (Vsup): 3.3 V

This voltage level is commonly used in many electronic devices, making this product versatile.

No. of Terminals: 16

The large number of terminals allows for connectivity with multiple components, increasing functionality.

Package Style (Meter): GRID ARRAY

The grid array package style provides stability and reliability in a compact form factor.

Maximum Operating Temperature: 125 °C

This high temperature threshold ensures the product can operate effectively in various environments.

Minimum Operating Temperature: -40 °C

The low temperature threshold allows the product to function in cold conditions without issues.

Terminal Position: BOTTOM

The bottom terminal position simplifies the connection process and enhances the overall design.

Maximum Seated Height: 0.679 mm

The low seated height enables the product to be used in slim devices and compact designs.

Width (mm): 2.17 mm

The narrow width facilitates placement in tight spaces, ideal for miniaturized devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This additional functionality supports power supply systems, enhancing overall performance.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Length: 2.225 mm

The compact length of the product allows for efficient use of board space in electronic applications.

Terminal Form: BALL

The ball terminal form provides secure connections and robust performance in demanding conditions.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting, making this product suitable for complex circuits.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage accommodates devices that require higher power input.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and optimization based on specific application requirements.

Technical Specifications

Power Management ICs PAC1951T-1E/J6CX attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B16

Length:

2.225 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

.679 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

2.17 mm

Trade Compliance

PAC1951T-1E/J6CX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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