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PAC1934T-I/6CX

Microchip Technology

PAC1934T-I/6CX by Microchip Technology

PAC1934T-I/6CX by Microchip Technology is a Power Management IC with 4 channels, operating at -40 to 85°C. It has a supply voltage range of 2.7V to 5.5V and adjustable threshold feature. This IC is ideal for industrial applications requiring precise power monitoring in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 873 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$1.141

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$1.084

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$1.084

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$1.141

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Semicontronic

India . 1,146 parts In-Stock

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$5.500

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$5.362

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$5.335

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Aztec Data Supply Inc.

USA . 3,017 parts In-Stock

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$5.540

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$5.540

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Ampacity Inc.

Singapore . 605 parts In-Stock

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$7.500

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$7.500

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AZTECH Wire

Italy . 334 parts In-Stock

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$18.358

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Corohmni

South Africa . 151 parts In-Stock

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$22.210

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Kepictronics

USA . 7,901 parts In-Stock

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Continental Prestige Electronics

USA . 2,232 parts In-Stock

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West Coast Incorporated

USA . 1,837 parts In-Stock

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Argo Parts USA

USA . 1,478 parts In-Stock

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Bastille Electronics

Australia . 38 parts In-Stock

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Overview

Unlock unparalleled power management capabilities with the Microchip Technology PAC1934T-I/6CX. Crafted with precision and expertise, this Power Management IC offers unrivaled performance in a sleek and durable package. Ideal for a wide range of applications, this innovative product delivers exceptional value and efficiency. Experience seamless power supply support and enhanced control with the PAC1934T-I/6CX by Microchip Technology. Elevate your projects to new heights with this industry-leading solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a cost-effective and durable solution for the Power Management IC.

Surface Mount: YES

Easy installation and space-saving design make this IC ideal for compact electronic devices.

Screening Level: TS 16949

This high screening level ensures reliability and quality performance in demanding automotive applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on a circuit board, optimizing space utilization.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with a common voltage supply, making it easy to integrate into existing systems.

No. of Terminals: 16

Sufficient terminals for connecting to multiple components, enabling versatile power management capabilities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch design and thin profile enhance electrical performance and thermal management.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of environmental conditions, enhancing versatility.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, making it suitable for various industrial applications.

Terminal Position: BOTTOM

The bottom terminal position enables easy connectivity to the circuit board and simplifies PCB layout.

Maximum Seated Height: 0.679 mm

Low profile design minimizes the overall height of the IC, ideal for slim electronic devices.

Width (mm): 2.17 mm

Compact width allows for efficient space utilization on the circuit board.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Provides comprehensive support for power supply functions, contributing to overall system reliability.

Minimum Supply Voltage (Vsup): 2.7 V

Supports a lower supply voltage, making it suitable for a wide range of power input requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliability during the reflow process, guaranteeing consistent performance.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures, ensuring reliable solder joints during assembly.

Length: 2.225 mm

Compact length allows for efficient placement on the circuit board, saving valuable space.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, withstanding harsh environmental conditions.

No. of Channels: 4

Multiple channels allow for versatile power management capabilities, accommodating various loads.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections for seamless integration.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density mounting, optimizing board space utilization.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a high supply voltage, suitable for applications with higher power requirements.

Adjustable Threshold: YES

The adjustable threshold feature allows for customized power management settings, enhancing flexibility.

Technical Specifications

Power Management ICs PAC1934T-I/6CX attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B16

Length:

2.225 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

.679 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.17 mm

Trade Compliance

PAC1934T-I/6CX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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