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MIC5801BWM

Microchip Technology

MIC5801BWM by Microchip Technology

MIC5801BWM by Microchip Technology is a latch-based peripheral driver with 8 functions. It offers transient protection and operates in industrial temperature range (-40 to 85°C). With sink output current flow direction, it is ideal for various applications requiring a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

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650

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A&K Electronics

USA . 560 parts In-Stock

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560

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Bristol Electronics

USA . 560 parts In-Stock

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560

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Vyrian

USA . 364 parts In-Stock

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364

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NAC Semi

USA . 84 parts In-Stock

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84

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Prism Electronics

USA . 69 parts In-Stock

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69

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First Choice Components Inc.

USA . 20 parts In-Stock

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20

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J & M Industries LLC

USA . 17 parts In-Stock

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J2 Sourcing AB

Sweden . 1 parts In-Stock

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Benley Electronics

USA . 4 parts In-Stock

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$1.750

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$1.750

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AZTECH Wire

Italy . 364 parts In-Stock

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$6.865

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364

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,346 parts In-Stock

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Argo Parts USA

USA . 4,372 parts In-Stock

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Continental Prestige Electronics

USA . 4,073 parts In-Stock

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Microchip USA

USA . 1,911 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Kepictronics

USA . 306 parts In-Stock

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306

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West Coast Incorporated

USA . 252 parts In-Stock

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252

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Overview

Enhance your electronic designs with the MIC5801BWM by Microchip Technology, a leading manufacturer known for its top-notch quality and reliability. This peripheral driver offers 8 functions in a compact rectangular package, making it perfect for a wide range of applications. With built-in transient protections and industrial-grade temperature tolerance, this IC provides peace of mind for your projects. Experience the value of seamless performance and efficiency with the MIC5801BWM, delivering unparalleled benefits to customers looking for high-quality solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the peripheral driver, making it suitable for long-term use.

Surface Mount: YES

The ability to be surface mounted facilitates easy and efficient integration into electronic devices or PCBs.

No. of Functions: 8

With 8 functions, this peripheral driver offers versatility and flexibility in controlling various peripherals or external components.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space and easy placement within electronic systems.

Built-in Protections: TRANSIENT

Transient protection ensures that the peripheral driver is safeguarded against voltage spikes or fluctuations, enhancing its reliability.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for interfacing with other components or devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space and makes the peripheral driver suitable for compact electronic designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the peripheral driver can function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C extends the operational range of the peripheral driver, making it suitable for use in harsh environments.

Terminal Position: DUAL

Dual terminal position enhances reliability and ensures secure connections for efficient operation.

Maximum Seated Height: 2.65 mm

The compact maximum seated height of 2.65 mm allows for low-profile installation, especially in space-constrained applications.

Width: 7.5 mm

The moderate width of 7.5 mm strikes a balance between space-saving design and ease of handling during installation.

Length: 15.4 mm

The length of 15.4 mm provides a compact form factor for the peripheral driver, ideal for integration into various electronic systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the peripheral driver can withstand rigorous operating conditions in industrial environments.

Technology: BIMOS

Utilizing BIMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and efficiency.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and enhances the reliability of connections for improved overall performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes this peripheral driver compatible with a wide range of electronic systems and devices.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density mounting and efficient PCB layout, contributing to space-saving designs.

Interface IC Type: LATCH BASED PERIPHERAL DRIVER

Being a latch-based peripheral driver facilitates stable output control and minimizes power consumption for efficient operation.

Output Current Flow Direction: SINK

The sink output current flow direction enables the peripheral driver to sink current from external devices, offering control flexibility and compatibility with various load types.

Technical Specifications

Peripheral Drivers MIC5801BWM attributes and parameters. Explore more Peripheral Drivers devices from Microchip Technology

Specs

Built-in Protections:

TRANSIENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MIC5801BWM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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