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MIC2591B-2YTQ-TR

Microchip Technology

MIC2591B-2YTQ-TR by Microchip Technology

MIC2591B-2YTQ-TR by Microchip: Power Management IC with 3.3V supply, 48 terminals, and 70°C max temp. Ideal for power supply support circuits in commercial applications due to adjustable threshold voltage and thin profile flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,105 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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Corohmni

South Africa . 373 parts In-Stock

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$8.725

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373

$8.725

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AZTECH Wire

Italy . 520 parts In-Stock

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$8.960

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520

$8.960

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Vigor

Singapore . 3,883 parts In-Stock

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$14.430

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$14.430

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Ampacity Inc.

Singapore . 1,584 parts In-Stock

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$20.770

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1,584

$20.770

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Microchip USA

USA . 3,779 parts In-Stock

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$51.828

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3,779

$51.828

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RGB Technical Solutions

Ukraine . 6,275 parts In-Stock

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6,275

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Argo Parts USA

USA . 3,678 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Continental Prestige Electronics

USA . 665 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Enhance your power management solutions with the MIC2591B-2YTQ-TR by Microchip Technology. This high-quality Power Management IC offers unmatched reliability and efficiency, making it ideal for a wide range of applications. With its sleek design and advanced features, this product provides exceptional value and benefits to customers looking for top-notch performance. Trust Microchip Technology to deliver cutting-edge technology that meets your power management needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability for the power management IC, making it a suitable choice for long-term use.

Surface Mount: YES

Surface mount capability makes installation and integration of the power management IC easier and more efficient.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3 V supply voltage ensures compatibility with a wide range of electronic devices and systems, enhancing the versatility of the power management IC.

No. of Terminals: 48

With 48 terminals, this power management IC can handle multiple connections and provide stable power distribution for various components.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C enables the power management IC to function effectively in demanding environments without overheating.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good conductivity and corrosion resistance, enhancing the overall performance and longevity of the power management IC.

Width (mm): 7 mm

Compact 7 mm width allows for easy placement and installation of the power management IC in limited space, making it a practical choice for small electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the power management IC is suitable for standard commercial applications, ensuring reliable performance in everyday use.

Maximum Supply Current (Isup): 5 mA

Low maximum supply current of 5 mA helps in reducing power consumption and heat generation, making the power management IC energy-efficient and cost-effective.

Maximum Supply Voltage (Vsup): 3.6 V

The 3.6 V maximum supply voltage provides a safe operating range for the power management IC, protecting it from overvoltage conditions and ensuring stable performance.

Technical Specifications

Power Management ICs MIC2591B-2YTQ-TR attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP48,.28SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+0.1V

Width (mm):

7 mm

Trade Compliance

MIC2591B-2YTQ-TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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