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MCP73837T-FJI/MF

Microchip Technology

MCP73837T-FJI/MF by Microchip Technology

MCP73837T-FJI/MF by Microchip is a Power Management IC with 10 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 4.5V to 6V and supports industrial temperature grade applications. The IC features adjustable threshold voltage at +4.2V, matte tin terminal finish, and small outline package style for power supply support circuits in various electronic devices.

Median Price

$1.521

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$1.540

100+ parts

-

1k+ parts

-

10k+ parts

-

29

$1.540

-

-

-

Bristol Electronics

USA . 3,247 parts In-Stock

1+ parts

-

100+ parts

$1.503

1k+ parts

$0.794

10k+ parts

-

3,247

-

$1.503

$0.794

-

Dan-Mar Components

USA . 3,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,247

-

-

-

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Vyrian

USA . 2,592 parts In-Stock

1+ parts

-

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2,592

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,313 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,313

$1.500

-

-

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Argo Parts USA

USA . 4,607 parts In-Stock

1+ parts

$1.540

100+ parts

-

1k+ parts

-

10k+ parts

-

4,607

$1.540

-

-

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Continental Prestige Electronics

USA . 1,687 parts In-Stock

1+ parts

$1.540

100+ parts

-

1k+ parts

-

10k+ parts

$1.509

1,687

$1.540

-

-

$1.509

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.540

100+ parts

-

1k+ parts

$1.463

10k+ parts

$1.432

100

$1.540

-

$1.463

$1.432

AZTECH Wire

Italy . 196 parts In-Stock

1+ parts

$17.354

100+ parts

-

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196

$17.354

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Lixinc

USA . 19,448 parts In-Stock

1+ parts

-

100+ parts

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19,448

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West Coast Incorporated

USA . 5,075 parts In-Stock

1+ parts

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5,075

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Overview

Enhance your power management system with the MCP73837T-FJI/MF from Microchip Technology. With a reputation for quality and reliability, Microchip Technology delivers cutting-edge solutions for various applications in the Power Management ICs category. The MCP73837T-FJI/MF offers customers exceptional value through its innovative design, efficient performance, and versatile applications. Experience the benefits of this product's high-quality construction, advanced features, and unparalleled advantages for your power management needs. Upgrade your system today with the MCP73837T-FJI/MF and see the difference Microchip Technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the power management IC.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage (Vsup): 5.2 V

Optimal supply voltage for reliable and efficient power management.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in a wide range of temperature conditions.

Maximum Seated Height: 1 mm

Low profile design makes it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed to meet the industrial temperature requirements for robust performance.

Nominal Threshold Voltage (V): +4.2V

Accurate threshold voltage for precise power management control.

Maximum Supply Current (Isup): 3 mA

Efficient power consumption for energy-saving operation.

Maximum Supply Voltage (Vsup): 6 V

Wide supply voltage range for compatibility with various power sources.

Technical Specifications

Power Management ICs MCP73837T-FJI/MF attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.2V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3 mm

Trade Compliance

MCP73837T-FJI/MF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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