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MCP73833T-BZI/UN

Microchip Technology

MCP73833T-BZI/UN by Microchip Technology

MCP73833T-BZI/UN by Microchip Technology is a Power Management IC with 10 terminals and a supply voltage range of 3.8-5.5V. It features a small outline package, operates in industrial temperature range (-40 to 85°C), and supports power supply circuits. Ideal for applications requiring precise power management in compact spaces.

Median Price

$1.240

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 9,900 parts In-Stock

1+ parts

$1.240

100+ parts

$0.930

1k+ parts

$0.870

10k+ parts

$0.810

9,900

$1.240

$0.930

$0.870

$0.810

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,156

-

-

-

-

Nova Conductors

Japan . 89 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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89

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,385 parts In-Stock

1+ parts

$0.810

100+ parts

-

1k+ parts

-

10k+ parts

-

3,385

$0.810

-

-

-

Ampacity Inc.

Singapore . 8,210 parts In-Stock

1+ parts

$1.050

100+ parts

-

1k+ parts

-

10k+ parts

-

8,210

$1.050

-

-

-

AZTECH Wire

Italy . 298 parts In-Stock

1+ parts

$14.890

100+ parts

-

1k+ parts

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10k+ parts

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298

$14.890

-

-

-

Aztec Data Supply Inc.

USA . 102 parts In-Stock

1+ parts

$20.348

100+ parts

-

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10k+ parts

-

102

$20.348

-

-

-

Corohmni

South Africa . 40 parts In-Stock

1+ parts

$23.397

100+ parts

-

1k+ parts

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10k+ parts

-

40

$23.397

-

-

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Lixinc

USA . 18,300 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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18,300

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Continental Prestige Electronics

USA . 6,613 parts In-Stock

1+ parts

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6,613

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West Coast Incorporated

USA . 3,693 parts In-Stock

1+ parts

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3,693

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Argo Parts USA

USA . 3,475 parts In-Stock

1+ parts

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3,475

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,000

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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500

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RC Electronics

USA . 400 parts In-Stock

1+ parts

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10k+ parts

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400

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Overview

Experience the cutting-edge technology of the MCP73833T-BZI/UN by Microchip Technology, a leading manufacturer in power management ICs. Ideal for a wide range of applications, this high-quality product offers unparalleled value with its innovative design and reliable performance. Unlock the benefits of this power supply support circuit, featuring a small outline, thin profile package shape that ensures seamless integration into your projects. Trust Microchip Technology to deliver excellence in every aspect, from industrial-grade temperature tolerance to adjustable threshold capabilities. Elevate your projects with the MCP73833T-BZI/UN and experience superior power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance of durability and cost-effectiveness.

Surface Mount: YES

Allows for easy and efficient installation on PCBs.

Screening Level: TS 16949

Ensures high quality and reliability for automotive applications.

Package Shape: RECTANGULAR

Maximizes space efficiency in compact designs.

Nominal Supply Voltage (Vsup): 5.2 V

Provides a stable and consistent power source for connected devices.

Power Supplies (V): 3.8/5.5

Compatible with a wide range of voltage requirements.

No. of Terminals: 10

Offers flexibility for various connection options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Ideal for compact and space-constrained applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Suitable for use in a wide range of temperature settings.

Terminal Finish: Matte Tin (Sn) - annealed

Provides good solderability and corrosion resistance.

Terminal Position: DUAL

Enables easy and secure attachment to the PCB.

Maximum Seated Height: 1.1 mm

Allows for low-profile designs.

Width (mm): 3 mm

Compact dimensions for space-saving layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Offers comprehensive power management capabilities.

Minimum Supply Voltage (Vsup): 3.75 V

Ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

Suitable for standard reflow soldering processes.

Length: 3 mm

Compact form factor for space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments.

Maximum Supply Current (Isup): 3 mA

Supports low-power applications efficiently.

Terminal Form: GULL WING

Provides secure and reliable electrical connections.

Terminal Pitch: 0.5 mm

Enables fine-pitch connections for compact designs.

Maximum Supply Voltage (Vsup): 6 V

Offers flexibility for higher voltage applications.

Adjustable Threshold: YES

Allows for customization to meet specific power management requirements.

Technical Specifications

Power Management ICs MCP73833T-BZI/UN attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.8/5.5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

3.75 V

Nominal Supply Voltage (Vsup):

5.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3 mm

Trade Compliance

MCP73833T-BZI/UN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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