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MCP6S92-E/SN

Microchip Technology

MCP6S92-E/SN by Microchip Technology

MCP6S92-E/SN by Microchip Technology is a small outline, surface mount analog circuit with 2 channels. It operates at a supply voltage range of 2.5V to 5.5V and has a temperature grade suitable for automotive applications.

Median Price

$1.380

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 253 parts In-Stock

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$1.380

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DigiKey

USA . 110 parts In-Stock

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$1.380

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$1.040

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Microchip Technology

USA . 40 parts In-Stock

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$1.380

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$1.040

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$1.010

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$1.000

40

$1.380

$1.040

$1.010

$1.000

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$1.080

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$1.080

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NAC Semi

USA . 70 parts In-Stock

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$1.370

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$1.240

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$1.110

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$1.370

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Bristol Electronics

USA . 155 parts In-Stock

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$2.184

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$1.354

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$1.092

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$1.092

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Vyrian

USA . 8,791 parts In-Stock

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Dan-Mar Components

USA . 155 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 262 parts In-Stock

1+ parts

$0.920

100+ parts

$0.897

1k+ parts

$0.892

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262

$0.920

$0.897

$0.892

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Ampacity Inc.

Singapore . 192 parts In-Stock

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$0.920

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Continental Prestige Electronics

USA . 4,349 parts In-Stock

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$1.080

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$1.058

4,349

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Argo Parts USA

USA . 1,714 parts In-Stock

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$1.080

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Netroflash

USA . 100 parts In-Stock

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$1.080

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$1.058

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Vigor

Singapore . 532 parts In-Stock

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$1.110

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532

$1.110

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Corohmni

South Africa . 249 parts In-Stock

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$15.232

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AZTECH Wire

Italy . 519 parts In-Stock

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$16.529

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$16.529

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Aztec Data Supply Inc.

USA . 3,672 parts In-Stock

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$20.350

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Lixinc

USA . 13,548 parts In-Stock

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Montano Global Distributors

Canada . 7,775 parts In-Stock

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LMD Electronica

Estonia . 7,340 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,694 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,224 parts In-Stock

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NIA Electronics

USA . 2,437 parts In-Stock

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Ledger Components

France . 2,437 parts In-Stock

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Perfect Parts

USA . 67 parts In-Stock

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Overview

Discover the MCP6S92-E/SN, a high-quality product by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology consistently delivers reliable and innovative solutions, and this product is no exception. With its wide range of applications in the category of Other Function Semiconductors, the MCP6S92-E/SN offers tremendous value to customers. Experience the benefits of its small outline package style and surface mount capability, making it easy to integrate into your projects. Plus, with its automotive temperature grade and TS 16949 screening level, you can trust in its durability and performance. Don't miss out on the advantages that the MCP6S92-E/SN brings to your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material provides durability and protection, making it suitable for various applications.

Surface Mount: YES

With surface mount capability, this product offers easy installation and integration into circuit boards, saving time and effort during assembly.

No. of Functions: 1

The presence of a single function simplifies circuit design and reduces complexity, making this product an efficient choice for specific applications.

Screening Level: TS 16949

With TS 16949 screening level, this product undergoes rigorous testing to ensure high quality and reliability, making it suitable for demanding automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape provides compatibility with standard circuit board layouts, facilitating easy integration into existing designs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a stable 5V supply voltage, this product offers consistent performance, ensuring reliable operation in various environments.

Power Supplies (V): 3/5

With support for both 3V and 5V power supplies, this product offers flexibility and compatibility with different systems, making it suitable for various applications.

No. of Terminals: 8

The presence of 8 terminals allows for efficient connectivity and signal routing, making this product suitable for applications requiring multiple connections.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-saving installation, making this product ideal for compact systems or designs with limited space.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this product remains operational even in extremely cold conditions, increasing its versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and excellent solderability, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

With dual terminal positions, this product allows flexibility in mounting configurations, making it suitable for various applications with different layout requirements.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm allows for compact and low-profile designs, making this product suitable for applications with space constraints.

Width (mm): 3.91 mm

With a compact width of 3.91mm, this product offers efficient utilization of board space, making it ideal for miniaturized electronic devices.

Other IC type: ANALOG CIRCUIT

Being an analog circuit, this product provides accurate and precise signal processing, making it suitable for applications requiring high-quality analog performance.

Minimum Supply Voltage (Vsup): 2.5 V

With a minimum supply voltage of 2.5V, this product can operate efficiently in low-power scenarios, offering energy-saving capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand a maximum of 30 seconds at peak reflow temperature, ensuring reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring stable and robust connections.

Length: 4.9 mm

With a compact length of 4.9mm, this product offers efficient utilization of board space, making it ideal for miniaturized electronic devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this product meets the temperature requirements and reliability standards of automotive applications, making it a dependable choice.

Maximum Supply Current (Isup): 1.6 mA

With a maximum supply current of 1.6mA, this product consumes low power, contributing to energy-efficiency and prolonged battery life.

No. of Channels: 2

With support for 2 channels, this product enables the simultaneous processing or transmission of multiple signals, enhancing versatility in multi-channel applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure solder joints and easy inspection during manufacturing, ensuring reliable connections and efficient production processes.

Terminal Pitch: 1.27 mm

With a standard terminal pitch of 1.27mm, this product provides compatibility for easy integration into existing designs and systems.

Moisture Sensitivity Level (MSL): 1

With an MSL of 1, this product is highly resistant to moisture, ensuring long-term reliability in humid environments.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product offers a wide input voltage range, accommodating varied power sources and systems.

Technical Specifications

Other Function Semiconductors MCP6S92-E/SN attributes and parameters. Explore more Other Function Semiconductors devices from Microchip Technology

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

1.6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.91 mm

Trade Compliance

MCP6S92-E/SN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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