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MCP47FVB21A1-E/ST

Microchip Technology

MCP47FVB21A1-E/ST by Microchip Technology

MCP47FVB21A1-E/ST by Microchip is a 12-bit D/A converter with 0.1465% EL, 6us tstl. It's used in automotive applications, operates b/w -40 to 125 °C, and has a small outline package style.

Median Price

$1.290

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$1.290

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Vyrian

USA . 6,659 parts In-Stock

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6,659

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Distributors (Availability)

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Vigor

Singapore . 5,262 parts In-Stock

1+ parts

$1.040

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$1.040

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Corohmni

South Africa . 437 parts In-Stock

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$1.228

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Continental Prestige Electronics

USA . 2,125 parts In-Stock

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$1.290

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$1.264

2,125

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$1.264

Argo Parts USA

USA . 556 parts In-Stock

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$1.290

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556

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Netroflash

USA . 100 parts In-Stock

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$1.290

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Aztec Data Supply Inc.

USA . 3,272 parts In-Stock

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$10.830

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3,272

$10.830

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Semicontronic

India . 1,520 parts In-Stock

1+ parts

$19.000

100+ parts

$18.525

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$18.430

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1,520

$19.000

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$18.430

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AZTECH Wire

Italy . 449 parts In-Stock

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$19.649

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Ampacity Inc.

Singapore . 134 parts In-Stock

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$23.000

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Lixinc

USA . 14,621 parts In-Stock

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Marpe Global Electronics

Taiwan . 6,819 parts In-Stock

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QualityLine Systems

Poland . 6,819 parts In-Stock

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XL Components Corporation

Australia . 6,819 parts In-Stock

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Overview

Unlock a world of precision and reliability with the MCP47FVB21A1-E/ST by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers top-quality Digital-to-Analog Converters perfect for automotive applications. With fast settling times, low supply current, and high linearity accuracy, this product offers unmatched value and performance for your projects. Trust Microchip Technology to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

With the ability to be surface mounted, this digital-to-analog converter offers easy installation and space-saving benefits in compact designs.

Screening Level: TS 16949

The TS 16949 screening level ensures high-quality and reliable performance, making this product suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and efficient design, allowing for easy integration into electronic systems.

No. of Bits: 12

With 12 bits, this converter offers high resolution and accuracy in converting digital signals to analog, ensuring precision in output signals.

Maximum Linearity Error (EL): 0.1465%

The low maximum linearity error of 0.1465% ensures accurate conversion of digital data to analog signals, resulting in reliable performance.

No. of Terminals: 8

The 8 terminals provide secure connections and easy integration into existing circuitry, making this converter user-friendly and versatile.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style allows for space-efficient placement and compatibility with various electronic devices.

Nominal Settling Time (tstl): 6 us

The nominal settling time of 6 microseconds ensures rapid response and minimal delay in converting digital inputs to analog outputs.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this converter offers reliable performance in high-temperature environments.

Technical Specifications

Digital-to-Analog Converters MCP47FVB21A1-E/ST attributes and parameters. Explore more Digital-to-Analog Converters devices from Microchip Technology

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1465 %

Nominal Settling Time (tstl):

6 µs

Maximum Supply Current:

500 μA

No. of Bits:

12

No. of Functions:

1

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

40 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Matte Tin

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.25

Standards and Codes

Screening Level:

TS 16949

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Trade Compliance

MCP47FVB21A1-E/ST Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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