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MCP47FVB11A0-E/ST

Microchip Technology

MCP47FVB11A0-E/ST by Microchip Technology

MCP47FVB11A0-E/ST by Microchip is a 10-bit D/A converter with 0.1465% EL, 6us tstl. It's used in automotive applications, operates b/w -40 to 125 °C, and has a small outline package style.

Median Price

$0.630

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 4,630 parts In-Stock

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$0.630

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$0.480

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$0.460

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4,630

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Mouser Electronics

USA . 689 parts In-Stock

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$0.630

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$0.480

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689

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DigiKey

USA . 600 parts In-Stock

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$0.630

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$0.480

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600

$0.630

$0.480

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Future Electronics

Canada . 1,100 parts In-Stock

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$0.460

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$0.445

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$0.425

1,100

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$0.460

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$0.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 3,700 parts In-Stock

1+ parts

$0.630

100+ parts

$0.570

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$0.510

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3,700

$0.630

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Nova Conductors

Japan . 50 parts In-Stock

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$0.840

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Vyrian

USA . 4,853 parts In-Stock

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Vigor

Singapore . 5,001 parts In-Stock

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$0.700

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$0.700

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Semicontronic

India . 3,938 parts In-Stock

1+ parts

$0.780

100+ parts

$0.760

1k+ parts

$0.757

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3,938

$0.780

$0.760

$0.757

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Ampacity Inc.

Singapore . 3,797 parts In-Stock

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$0.780

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Corohmni

South Africa . 441 parts In-Stock

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$0.832

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Argo Parts USA

USA . 3,828 parts In-Stock

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$0.840

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Continental Prestige Electronics

USA . 2,083 parts In-Stock

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$0.840

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$0.823

2,083

$0.840

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$0.823

Netroflash

USA . 50 parts In-Stock

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$0.840

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Aztec Data Supply Inc.

USA . 2,755 parts In-Stock

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$27.310

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$27.310

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Fulton Briggs Corp.

USA . 3,712 parts In-Stock

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Overview

Elevate your projects with the MCP47FVB11A0-E/ST by Microchip Technology, a top-tier Digital-to-Analog Converter that delivers unparalleled quality and precision. Designed with automotive-grade materials and advanced technology, this converter offers fast settling time and low linearity error, ensuring optimal performance in various applications. Experience the benefits of smooth signal conversion and reliable operation, making it a valuable asset for your electronic designs. Choose Microchip Technology for excellence, choose the MCP47FVB11A0-E/ST for superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and reliability, making this product suitable for various environments and conditions.

Surface Mount: YES

The surface mount capability makes installation and connection of this digital-to-analog converter easier and more efficient.

No. of Bits: 10

With 10 bits, this converter offers higher resolution and accuracy in converting digital signals to analog signals, resulting in better overall performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this converter to be used in automotive applications where temperature fluctuations may occur.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this converter can withstand high-temperature soldering processes, ensuring reliable assembly.

Technical Specifications

Digital-to-Analog Converters MCP47FVB11A0-E/ST attributes and parameters. Explore more Digital-to-Analog Converters devices from Microchip Technology

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1465 %

Nominal Settling Time (tstl):

6 µs

Maximum Supply Current:

500 μA

No. of Bits:

10

No. of Functions:

1

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

40 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Matte Tin

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.25

Standards and Codes

Screening Level:

TS 16949

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Trade Compliance

MCP47FVB11A0-E/ST Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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