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MCP33111D-05-E/MN

Microchip Technology

MCP33111D-05-E/MN by Microchip Technology

MCP33111D-05-E/MN by Microchip is a 12-bit ADC with 1.3us conversion time, 0.5MHz sample rate, and 2mA max supply current. Ideal for automotive applications due to AEC-Q100 screening, it operates b/w -40°C to 125°C with a small outline package style.

Median Price

$2.361

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Arrow

USA . 230 parts In-Stock

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$2.361

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Verical

USA . 230 parts In-Stock

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Nova Conductors

Japan . 88 parts In-Stock

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$2.128

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NAC Semi

USA . 6,240 parts In-Stock

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$2.820

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$2.540

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$2.290

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Vyrian

USA . 4,732 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 239 parts In-Stock

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Bristol Electronics

USA . 239 parts In-Stock

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$1.530

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$1.421

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Dan-Mar Components

USA . 239 parts In-Stock

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$0.770

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Continental Prestige Electronics

USA . 6,986 parts In-Stock

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$2.128

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$2.086

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Argo Parts USA

USA . 4,366 parts In-Stock

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$2.128

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Netroflash

USA . 50 parts In-Stock

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AZTECH Wire

Italy . 540 parts In-Stock

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$9.893

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540

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Montano Global Distributors

Canada . 7,623 parts In-Stock

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LOOK Integrated Logistics

Peru . 7,009 parts In-Stock

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LMD Electronica

Estonia . 2,198 parts In-Stock

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NIA Electronics

USA . 957 parts In-Stock

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Ledger Components

France . 957 parts In-Stock

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Overview

Experience unparalleled precision and performance with the MCP33111D-05-E/MN by Microchip Technology. As a leader in Analog-to-Digital Converters, Microchip Technology ensures top-notch quality and reliability in every product. Ideal for automotive applications, this ADC offers a fast conversion time of 1.3 us and a high sample rate of 0.5 MHz. With a wide temperature range and compact design, the MCP33111D-05-E/MN is the perfect choice for customers looking for superior functionality and value in their electronic systems. Trust Microchip Technology to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort during production.

Screening Level: AEC-Q100; TS 16949

Compliance with AEC-Q100 and TS 16949 standards ensures high quality, reliability, and performance in automotive applications.

No. of Bits: 12

With 12 bits resolution, this ADC provides high accuracy and precision in converting analog signals to digital, making it suitable for applications requiring fine resolution.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the ADC to operate in harsh environments without compromising performance, making it suitable for automotive and industrial applications.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage requirement makes this ADC energy-efficient, suitable for battery-powered devices or applications where power consumption is a concern.

Technical Specifications

Analog-to-Digital Converters MCP33111D-05-E/MN attributes and parameters. Explore more Analog-to-Digital Converters devices from Microchip Technology

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Sample Rate:

500 kHz

Maximum Conversion Time:

1.3 µs

Electrical Specifications

Minimum Analog Input Voltage:

-5.1 V

Maximum Analog Input Voltage:

5.1 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

2 mA

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

10

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

SOLCC10,.12,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-N10

Screening Level:

AEC-Q100; TS 16949

Trade Compliance

MCP33111D-05-E/MN Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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