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MCP3221A6T-E/OTVAO

Microchip Technology

MCP3221A6T-E/OTVAO by Microchip Technology

MCP3221A6T-E/OTVAO by Microchip: 12-bit ADC with 0.0488% EL, 5.8V max analog input, and 0.0223 MHz sample rate. Ideal for automotive applications due to AEC-Q100 screening, -40 to 125°C operating temp range, and small form factor.

Median Price

$2.030

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 21,000 parts In-Stock

1+ parts

$2.030

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$1.540

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$1.490

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$1.470

21,000

$2.030

$1.540

$1.490

$1.470

Distributors (In-Stock)

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Nova Conductors

Japan . 59 parts In-Stock

1+ parts

$1.843

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59

$1.843

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Vyrian

USA . 8,498 parts In-Stock

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Bristol Electronics

USA . 2,232 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 20,905 parts In-Stock

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$1.730

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$1.730

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Aranea Global

USA . 100 parts In-Stock

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$1.806

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$1.734

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100

$1.806

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$1.734

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Continental Prestige Electronics

USA . 3,986 parts In-Stock

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$1.843

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$1.806

3,986

$1.843

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$1.806

Argo Parts USA

USA . 1,945 parts In-Stock

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$1.843

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$1.843

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AZTECH Wire

Italy . 670 parts In-Stock

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$13.930

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670

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Lixinc

USA . 12,197 parts In-Stock

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Vigor

Singapore . 7,600 parts In-Stock

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Montano Global Distributors

Canada . 7,519 parts In-Stock

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NIA Electronics

USA . 4,280 parts In-Stock

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Ledger Components

France . 4,280 parts In-Stock

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LMD Electronica

Estonia . 3,425 parts In-Stock

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Microchip USA

USA . 2,470 parts In-Stock

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iodParts Technologies Inc.

India . 2,248 parts In-Stock

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LOOK Integrated Logistics

Peru . 1,791 parts In-Stock

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Overview

Discover the cutting-edge MCP3221A6T-E/OTVAO by Microchip Technology, a top-of-the-line Analog-to-Digital Converter that guarantees unparalleled quality and performance. With a focus on automotive applications, this innovative product boasts AEC-Q100 and TS 16949 screening levels, ensuring reliability and durability. Experience smooth and precise data conversion with its 12-bit resolution and low linearity error, while its compact design and wide temperature range make it ideal for space-constrained and demanding environments. Elevate your projects with the MCP3221A6T-E/OTVAO and unlock endless possibilities in the world of analog-to-digital conversion.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material ensures durability and reliability for long-term use.

Surface Mount: YES

Being surface mountable makes installation easier and more space-efficient.

No. of Bits: 12

With 12 bits, this ADC provides higher resolution for accurate analog-to-digital conversion.

Maximum Operating Temperature: 125 °C

Capable of operating at a high temperature range, suitable for automotive applications and harsh environments.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making it energy-efficient.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes integration into existing systems easier.

Technical Specifications

Analog-to-Digital Converters MCP3221A6T-E/OTVAO attributes and parameters. Explore more Analog-to-Digital Converters devices from Microchip Technology

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

22.3 kHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

-300 mV

Maximum Analog Input Voltage:

5.8 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

250 μA

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

5

Terminal Form:

Terminal Pitch:

0.037 in (0.95 mm)

Surface Mount:

Yes

Width:

0.064 in (1.63 mm)

Length:

0.116 in (2.95 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSOP5/6,.11,37

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Screening Level:

AEC-Q100; TS 16949

Trade Compliance

MCP3221A6T-E/OTVAO Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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