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MCP25612FDT-E/SL

Microchip Technology

MCP25612FDT-E/SL by Microchip Technology

MCP25612FDT-E/SL by Microchip Tech: 2 CAN FD transceivers, 8 Mbps data rate, 70 mA max supply current. Automotive grade for network interfaces in automotive applications.

Median Price

$1.440

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,818 parts In-Stock

1+ parts

$1.440

100+ parts

-

1k+ parts

-

10k+ parts

-

2,818

$1.440

-

-

-

Microchip Technology

USA . 500 parts In-Stock

1+ parts

$1.440

100+ parts

$1.090

1k+ parts

$1.050

10k+ parts

-

500

$1.440

$1.090

$1.050

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,980 parts In-Stock

1+ parts

$0.850

100+ parts

-

1k+ parts

-

10k+ parts

-

3,980

$0.850

-

-

-

RGB Technical Solutions

Ukraine . 510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

510

-

-

-

-

Overview

Experience seamless communication with the MCP25612FDT-E/SL by Microchip Technology. Known for their superior quality, this network interface device offers reliability and efficiency in various applications. Whether you're in automotive, industrial, or consumer electronics, this product delivers unmatched performance with its CAN FD transceiver technology. With a compact design and wide temperature range, the MCP25612FDT-E/SL provides value and convenience to customers looking for a cutting-edge solution. Elevate your networking experience with this top-of-the-line product from Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers durability and lightweight design, making this product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design in electronic applications.

No. of Functions: 2

Having 2 functions in one component saves space on the PCB and reduces the need for additional components.

Screening Level: TS 16949

Compliant with TS 16949 standards ensures high quality and reliability in automotive applications.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration into circuit designs and efficient use of space on the PCB.

No. of Terminals: 14

With 14 terminals, this product offers flexibility in connectivity options and allows for versatile usage.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and makes it suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in challenging thermal conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40 to 125°C allows for operation in extreme environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for multiple connection options and flexibility in circuit layout.

Maximum Seated Height: 1.75 mm

Low seated height enables compact design and minimizes overall PCB profile.

Width: 3.9 mm

Narrow width design saves space on the PCB and facilitates efficient circuit layout.

Length: 8.65 mm

Compact length dimensions make it suitable for space-constrained electronic applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures performance in automotive and industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of inspection during assembly.

No. of Transceivers: 2

Having 2 transceivers enables communication between devices and enhances connectivity capabilities.

Maximum Supply Current: 70 mA

Low maximum supply current consumption for energy-efficient operation in electronic systems.

Telecom IC Type: CAN FD TRANSCEIVER

Specifically designed for CAN FD communication protocol, suitable for automotive and industrial applications.

Nominal Supply Voltage: 5 V

5V nominal supply voltage is common in electronic systems and ensures compatibility with various devices.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm allows for easy PCB layout and soldering process.

Data Rate: 8 Mbps

High data rate of 8 Mbps enables fast and efficient data transmission in electronic networks.

Technical Specifications

Network Interfaces MCP25612FDT-E/SL attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

Data Rate:

8 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

No. of Functions:

2

No. of Terminals:

14

No. of Transceivers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

70 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MCP25612FDT-E/SL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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