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MCP2003BT-H/MF

Microchip Technology

MCP2003BT-H/MF by Microchip Technology

MCP2003BT-H/MF by Microchip is a LIN transceiver with 8 terminals, operating from -40 to 150°C. It features a small outline package style and matte tin finish, suitable for automotive network interfaces. With TS 16949 screening level, it's ideal for telecom applications requiring a 12V supply voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,551 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,551

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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-

1k+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 9,220 parts In-Stock

1+ parts

$0.900

100+ parts

$0.760

1k+ parts

$0.740

10k+ parts

-

9,220

$0.900

$0.760

$0.740

-

AZTECH Wire

Italy . 278 parts In-Stock

1+ parts

$20.980

100+ parts

-

1k+ parts

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10k+ parts

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278

$20.980

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Ampacity Inc.

Singapore . 1,544 parts In-Stock

1+ parts

$706.000

100+ parts

-

1k+ parts

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10k+ parts

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1,544

$706.000

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Lixinc

USA . 13,344 parts In-Stock

1+ parts

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13,344

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

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-

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RC Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.750

1k+ parts

$0.700

10k+ parts

$0.690

3,000

-

$0.750

$0.700

$0.690

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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100

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RGB Technical Solutions

Ukraine . 31 parts In-Stock

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31

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Overview

Enhance your network interfaces with the MCP2003BT-H/MF from Microchip Technology, a leading manufacturer known for top-quality products. This LIN transceiver offers unmatched reliability and performance, making it ideal for a wide range of applications. With a small outline and very thin profile, this product is designed for maximum efficiency and ease of use. Increase your connectivity and streamline your operations with the MCP2003BT-H/MF, providing value, benefits, and advantages that will take your network to the next level. Elevate your systems with Microchip Technology's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and impact resistance, making the product suitable for various environments.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Screening Level: TS 16949

Compliance with this standard ensures high quality and reliability of the product.

Maximum Operating Temperature: 150 °C

Withstands high temperatures without compromising performance, making it suitable for industrial applications.

Terminal Finish: MATTE TIN

Provides good solderability and corrosion resistance, ensuring long-term reliability of connections.

Nominal Supply Voltage: 12 V

Optimal voltage for efficient operation, ensuring stability and performance of the product.

Technical Specifications

Network Interfaces MCP2003BT-H/MF attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MCP2003BT-H/MF Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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