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MCP1790-5002E/DBVAO

Microchip Technology

MCP1790-5002E/DBVAO by Microchip Technology

MCP1790-5002E/DBVAO by Microchip is a fixed positive single output LDO regulator with 5V nominal output voltage, 1.3V max dropout voltage, and 0.07A max output current. Ideal for applications requiring stable voltage regulation in automotive electronics due to AEC-Q100 screening and TS 16949 compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,666 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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AZTECH Wire

Italy . 417 parts In-Stock

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$10.849

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417

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Ampacity Inc.

Singapore . 1,218 parts In-Stock

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$19.500

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XL Components Corporation

Australia . 8,368 parts In-Stock

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Marpe Global Electronics

Taiwan . 7,399 parts In-Stock

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

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6,000

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Vigor

Singapore . 5,977 parts In-Stock

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QualityLine Systems

Poland . 2,008 parts In-Stock

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Microchip USA

USA . 1,524 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Need a reliable and high-quality fixed regulator for your electronic project? Look no further than the MCP1790-5002E/DBVAO by Microchip Technology. With a robust AEC-Q100 and TS 16949 screening level, this positive single output LDO regulator offers exceptional performance and stability. Ideal for a wide range of applications, this regulator provides a nominal output voltage of 5V with a maximum output current of 0.07A. Trust in Microchip Technology's expertise and choose the MCP1790-5002E/DBVAO for your next design project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for portable devices.

Maximum Dropout Voltage-1: 1.3 V

With a low dropout voltage of 1.3V, this regulator is efficient and ensures a stable output voltage even when the input voltage fluctuates.

Surface Mount: YES

Being surface mount compatible, this regulator is easy to install on circuit boards, saving time and effort during assembly.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature of 125°C, this regulator can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Screening Level: AEC-Q100; TS 16949

This product meets AEC-Q100 and TS 16949 screening standards, ensuring high quality and reliability for automotive and industrial applications.

Technology: CMOS

The use of CMOS technology in this regulator results in low power consumption, making it energy-efficient and ideal for battery-powered devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement on circuit boards, optimizing space utilization in compact electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides a strong and reliable connection, ensuring stable performance and durability in various operating conditions.

Operating Temperature (TJ-Min): -40 °C

With a minimum operating temperature of -40°C, this regulator can function effectively in cold environments, making it versatile for different applications.

Packing Method: TUBE

The packaging in tubes ensures convenient handling and storage, protecting the regulator from damage during transportation and assembly processes.

Technical Specifications

Fixed Regulators - Positive Single Output LDO MCP1790-5002E/DBVAO attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Microchip Technology

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1.3 V

Nominal Dropout Voltage-1:

.7 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

30 V

Minimum Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Maximum Line Regulation:

.06 %

Maximum Load Regulation:

.0225 %

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.07 A

Maximum Output Voltage-1:

5.125 V

Minimum Output Voltage-1:

4.875 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.8 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

3.5 mm

Trade Compliance

MCP1790-5002E/DBVAO Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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