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MCP111T-270E/MB

Microchip Technology

MCP111T-270E/MB by Microchip Technology

MCP111T-270E/MB by Microchip Tech: Power Management IC, Vsup 1-5.5V, Temp -40 to 125°C. Ideal for automotive applications due to TS16949 screening level and small outline package style.

Median Price

$0.354

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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Netroflash

USA . 2,000 parts In-Stock

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Vigor

Singapore . 1,792 parts In-Stock

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Ampacity Inc.

Singapore . 1,556 parts In-Stock

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AZTECH Wire

Italy . 860 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,881 parts In-Stock

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NIA Electronics

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Ledger Components

France . 6,771 parts In-Stock

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Authorized Procurement Solutions

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LOOK Integrated Logistics

Peru . 3,737 parts In-Stock

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LMD Electronica

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Montano Global Distributors

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Overview

Enhance your power management system with the MCP111T-270E/MB by Microchip Technology. Known for its superior quality and reliability, this Power Management IC is a game-changer in the industry. Perfect for automotive applications, this small outline, low profile package offers a nominal supply voltage of 3V and a wide power supply range of 1V to 5.5V. With a maximum operating temperature of 125°C and TS 16949 screening level, this IC provides optimal performance and efficiency. Upgrade your power systems today with the MCP111T-270E/MB and experience seamless functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and durability for long-term use.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage (Vsup): 3 V

Suitable for a wide range of applications requiring a 3V power supply.

No. of Terminals: 3

Simple and straightforward design with fewer terminals for easier integration.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for harsh operating conditions.

Minimum Operating Temperature: -40 °C

Operational in extreme cold environments without any performance issues.

Terminal Finish: Matte Tin (Sn)

Provides corrosion resistance and enhances solderability for reliable connections.

Width (mm): 2.445 mm

Compact size allows for space-saving installations in tight layouts.

Minimum Supply Voltage (Vsup): 1 V

Offers flexibility in power input, suitable for low voltage applications.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliable performance in automotive applications.

Maximum Supply Current (Isup): 0.00175 mA

Low power consumption for energy-efficient operation.

Maximum Supply Voltage (Vsup): 5.5 V

Handles a wide range of supply voltages for versatile compatibility.

Technical Specifications

Power Management ICs MCP111T-270E/MB attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PSSO-F3

JESD-609 Code:

e3

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-243

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.6 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.00175 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

FLAT

Terminal Pitch:

1.5 mm

Terminal Position:

SINGLE

Nominal Threshold Voltage (V):

+2.63V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

2.445 mm

Trade Compliance

MCP111T-270E/MB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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