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KS8995MAI

Microchip Technology

KS8995MAI by Microchip Technology

Microchip Technology's KS8995MAI is an Ethernet switch IC with 128 terminals. It operates at -40 to 85°C, consuming 230mA at 1.8V. The CMOS technology and quad terminal position make it ideal for telecom applications.

Median Price

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8

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< 1k

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Vyrian

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Nova Conductors

Japan . 150 parts In-Stock

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QIE Inc.

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Prism Electronics

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Beltway Electronics Company

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Connector Distribution Corp

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Right Parts Inc.

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Aztec Data Supply Inc.

USA . 1,608 parts In-Stock

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$7.240

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AZTECH Wire

Italy . 659 parts In-Stock

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Corohmni

South Africa . 527 parts In-Stock

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Ampacity Inc.

Singapore . 568 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,644 parts In-Stock

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Continental Prestige Electronics

USA . 5,555 parts In-Stock

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Alle Elektronik GmbH

Germany . 5,096 parts In-Stock

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RGB Technical Solutions

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Argo Parts USA

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Microchip USA

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Kepictronics

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Bastille Electronics

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Overview

Elevate your network performance with the Microchip Technology KS8995MAI, a top-of-the-line Ethernet switch that guarantees reliable connectivity and seamless data transmission. As a renowned manufacturer in the industry, Microchip Technology delivers superior quality products that exceed expectations. Ideal for various telecom applications, this switch offers unparalleled value with its innovative technology and efficient design. Say goodbye to connectivity issues and experience the advantages of the KS8995MAI – where speed, reliability, and performance come together for an exceptional networking experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation properties and resistance to environmental factors, making the IC durable and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and facilitating automated production processes.

No. of Terminals: 128

Having a high number of terminals enables the IC to handle complex switching functions within a telecom system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can operate reliably in demanding industrial environments without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable for telecom applications.

Nominal Supply Voltage: 1.8 V

Operating at a low nominal supply voltage, this IC helps save power and reduce heat dissipation, contributing to overall system efficiency.

Technical Specifications

Telecom - Switching ICs KS8995MAI attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PQFP-G128

Length:

20 mm

No. of Functions:

1

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.68X.91,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.4 mm

Maximum Supply Current:

230 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

KS8995MAI Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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