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HV7322-V/AGA

Microchip Technology

HV7322-V/AGA by Microchip Technology

HV7322-V/AGA by Microchip Technology is a consumer IC with 206 terminals in a grid array package. It operates b/w 0-85°C, with Vsup ranging from 2.25-3.6V. Ideal for applications requiring thin profile and fine pitch technology like automotive electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,455 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,455

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 853 parts In-Stock

1+ parts

$3.920

100+ parts

-

1k+ parts

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853

$3.920

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AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$14.560

100+ parts

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719

$14.560

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West Coast Incorporated

USA . 7,741 parts In-Stock

1+ parts

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7,741

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Argo Parts USA

USA . 5,970 parts In-Stock

1+ parts

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5,970

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Continental Prestige Electronics

USA . 2,004 parts In-Stock

1+ parts

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2,004

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Overview

Discover a world of endless possibilities with the HV7322-V/AGA by Microchip Technology. Known for their top-notch quality and innovation, Microchip Technology has created a gem in the category of Other Function Consumer ICs. This versatile product offers a wide range of applications, from consumer electronics to industrial automation. With its compact design and high performance, this IC is a game-changer for your projects. Embrace the value, benefits, and advantages that this product brings to the table and unlock your creativity like never before. Elevate your creations with the HV7322-V/AGA and experience excellence in every aspect.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ensuring longevity and ease of handling.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space during production.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability, making this product ideal for applications where precision and consistency are crucial.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand challenging environmental conditions, enhancing its versatility.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable in various consumer electronic applications.

Technical Specifications

Other Function Consumer ICs HV7322-V/AGA attributes and parameters. Explore more Other Function Consumer ICs devices from Microchip Technology

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B206

Length:

12 mm

No. of Functions:

1

No. of Terminals:

206

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA206,18X18,25

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

HV7322-V/AGA General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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