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DS3105LN+

Microchip Technology

DS3105LN+ by Microchip Technology

ATM/SONET/SDH SUPPORT CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 707 parts In-Stock

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707

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Vyrian

USA . 261 parts In-Stock

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261

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Anansix

USA . 173 parts In-Stock

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173

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Distributors (Availability)

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MARBEL Systems

Belgium . 2,669 parts In-Stock

1+ parts

$11.087

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-

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2,669

$11.087

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Texas Native Microelectronics

USA . 974 parts In-Stock

1+ parts

$12.744

100+ parts

$12.234

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$11.852

10k+ parts

$11.215

974

$12.744

$12.234

$11.852

$11.215

Kenton Components

USA . 3,936 parts In-Stock

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$15.293

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$13.458

3,936

$15.293

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$13.458

Qasali Group International

UK . 3,695 parts In-Stock

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$34.409

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$32.000

10k+ parts

$30.280

3,695

$34.409

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$32.000

$30.280

Semicontronic

India . 1,348 parts In-Stock

1+ parts

$101.000

100+ parts

$98.475

1k+ parts

$97.970

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1,348

$101.000

$98.475

$97.970

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Native Components

USA . 547 parts In-Stock

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$219.742

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$210.952

547

$219.742

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$210.952

Northwest PG Solutions

USA . 647 parts In-Stock

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$241.716

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647

$241.716

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One Stop Electronics

USA . 932 parts In-Stock

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$704.000

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932

$704.000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Fulton Briggs Corp.

USA . 1,838 parts In-Stock

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Corphita

USA . 1,523 parts In-Stock

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1,523

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Technical Specifications

ATM/SONET/SDH Circuits DS3105LN+ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

192 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

DS3105LN+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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