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CEC1702Q-S1-I/SX

Microchip Technology

CEC1702Q-S1-I/SX by Microchip Technology

CEC1702Q-S1-I/SX by Microchip Technology is a 32-bit microcontroller with 65 I/O lines, PWM and ADC channels. Operating at -40 to 85 °C, it features a CMOS technology, TS 16949 screening level, and a package style of GRID ARRAY for industrial applications.

Median Price

$8.100

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 164 parts In-Stock

1+ parts

$8.100

100+ parts

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1k+ parts

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10k+ parts

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164

$8.100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RGB Technical Solutions

Ukraine . 2,536 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,536

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Overview

Enhance your projects with the high-quality CEC1702Q-S1-I/SX microcontroller from Microchip Technology. Designed with precision and reliability in mind, this advanced device is perfect for a wide range of applications. Whether you're working on IoT devices, security systems, or industrial automation, this microcontroller offers unmatched value, benefits, and advantages to help you bring your ideas to life. Trust Microchip Technology for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and quick installation on circuit boards.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage provides flexibility in power requirements for different applications.

Screening Level: TS 16949

Meeting TS 16949 screening level ensures high reliability and quality of the product.

Package Shape: SQUARE

The square package shape makes it compatible with various board layouts and designs.

Bit Size: 32

The 32-bit size enables the microcontroller to handle complex instructions and calculations efficiently.

No. of Terminals: 84

Having 84 terminals allows for a greater degree of connectivity and input/output options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enhances the overall compactness and efficiency of the microcontroller.

Minimum Supply Voltage: 2 V

The low minimum supply voltage requirement makes the microcontroller energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this microcontroller suitable for a wide range of applications.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data for processing.

DMA Channels: YES

Having DMA channels enables the microcontroller to efficiently transfer data between peripherals and memory without CPU intervention.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and improves heat dissipation.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8 mm facilitates compact and slim device designs.

Width: 7 mm

The narrow width of 7 mm makes the microcontroller space-saving and suitable for tight layouts.

Length: 7 mm

The short length of 7 mm enhances the overall compactness and integration of the microcontroller.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures the microcontroller's reliability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers high performance and efficient operation for various applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity for the microcontroller.

Terminal Form: BALL

The ball terminal form offers reliable electrical connections and ease of soldering during assembly.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage provides stable power delivery to the microcontroller for consistent performance.

PWM Channels: YES

Having PWM channels allows the microcontroller to generate precise analog output signals for controlling various devices.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density mounting and connectivity in compact PCB designs.

No. of I/O Lines: 65

With 65 I/O lines, the microcontroller offers versatile input/output capabilities for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers CEC1702Q-S1-I/SX attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B84

Length:

7 mm

No. of I/O Lines:

65

No. of Terminals:

84

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Screening Level:

TS 16949

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CEC1702Q-S1-I/SX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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