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AVR32DA28-I/SSVAO

Microchip Technology

AVR32DA28-I/SSVAO by Microchip Technology

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

Median Price

$1.750

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 141 parts In-Stock

1+ parts

$1.750

100+ parts

$1.460

1k+ parts

$1.340

10k+ parts

$1.270

141

$1.750

$1.460

$1.340

$1.270

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

465

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

LOOK Integrated Logistics

Peru . 8,273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,273

-

-

-

-

NIA Electronics

USA . 7,019 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

7,019

-

-

-

-

Montano Global Distributors

Canada . 6,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,253

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-

-

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LMD Electronica

Estonia . 4,942 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,942

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-

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Ledger Components

France . 149 parts In-Stock

1+ parts

-

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149

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Technical Specifications

Microcontrollers AVR32DA28-I/SSVAO attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

AVR

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

Low Power Mode:

YES

No. of External Interrupts:

23

No. of I/O Lines:

23

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

2 mm

Speed:

24 rpm

Maximum Supply Current:

5.3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Data EEPROM Size:

512

Connectivity:

I2C, SPI(2), TWI, USART(3)

Peripherals:

ANALOG COMPARATOR(3), BOD, POR, PWM(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

AVR32DA28-I/SSVAO Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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