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ATTINY426-XF

Microchip Technology

ATTINY426-XF by Microchip Technology

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$0.860

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 5,556 parts In-Stock

1+ parts

$0.860

100+ parts

$0.710

1k+ parts

$0.660

10k+ parts

$0.630

5,556

$0.860

$0.710

$0.660

$0.630

DigiKey

USA . 287 parts In-Stock

1+ parts

$0.860

100+ parts

$0.847

1k+ parts

-

10k+ parts

-

287

$0.860

$0.847

-

-

Mouser Electronics

USA . 149 parts In-Stock

1+ parts

$0.860

100+ parts

$0.847

1k+ parts

$0.822

10k+ parts

$0.814

149

$0.860

$0.847

$0.822

$0.814

Verical

USA . 103 parts In-Stock

1+ parts

-

100+ parts

$1.680

1k+ parts

$1.666

10k+ parts

-

103

-

$1.680

$1.666

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 434 parts In-Stock

1+ parts

$0.754

100+ parts

-

1k+ parts

-

10k+ parts

-

434

$0.754

-

-

-

TME

Poland . 103 parts In-Stock

1+ parts

$1.450

100+ parts

$1.330

1k+ parts

$1.230

10k+ parts

-

103

$1.450

$1.330

$1.230

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

RGB Technical Solutions

Ukraine . 3,687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,687

-

-

-

-

Technical Specifications

Microcontrollers ATTINY426-XF attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 8MHZ AT 2.7MIN

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

AVR RISC

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

7.2 mm

Low Power Mode:

YES

No. of External Interrupts:

18

No. of I/O Lines:

18

No. of Serial I/Os:

2

No. of Terminals:

20

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

RAM Bytes:

512

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

2 mm

Speed:

16 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Data EEPROM Size:

128

Connectivity:

I2C, SPI, USART(2)

Peripherals:

BOD, COMPARATOR, POR, RTC, TIMER(3), WDT

Analog To Digital Convertors:

15-Ch 12-Bit

Trade Compliance

ATTINY426-XF Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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