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ATSAME70Q20B-CFNT

Microchip Technology

ATSAME70Q20B-CFNT by Microchip Technology

Microchip ATSAME70Q20B-CFNT is a 32-bit Cortex-M7 microcontroller with 24-bit address bus width and 144 terminals. It features 8-bit on-chip data RAM, 12 ADC channels, and operates at up to 20 MHz. Ideal for industrial applications requiring low power consumption, it supports various peripherals like CAN, Ethernet, and I2C connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,142 parts In-Stock

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VNN

France . 2,214 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 293 parts In-Stock

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$5.022

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Vigor

Singapore . 4,803 parts In-Stock

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$10.770

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Ampacity Inc.

Singapore . 4,192 parts In-Stock

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$13.060

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$13.060

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Semicontronic

India . 4,422 parts In-Stock

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$28.430

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$27.719

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$27.577

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$28.430

$27.719

$27.577

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Corohmni

South Africa . 104 parts In-Stock

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$29.696

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Aztec Data Supply Inc.

USA . 2,406 parts In-Stock

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$77.950

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QUARKTWIN TECHNOLOGY LTD

USA . 22,628 parts In-Stock

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Continental Prestige Electronics

USA . 5,574 parts In-Stock

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Microchip USA

USA . 3,814 parts In-Stock

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Argo Parts USA

USA . 2,855 parts In-Stock

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Fulton Briggs Corp.

USA . 2,018 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Revolutionize your projects with the ATSAME70Q20B-CFNT microcontroller by Microchip Technology. As a leader in the industry, Microchip guarantees top-notch quality and reliability. This powerful microcontroller boasts integrated cache, advanced peripherals, and low power modes, making it perfect for a wide range of applications. Experience seamless connectivity with CAN, Ethernet, I2C, and more. Trust Microchip's ATSAME70Q20B-CFNT to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and cost-effectiveness.

Integrated Cache: YES

Having an integrated cache can improve the performance of the microcontroller by reducing memory access times.

Maximum Supply Voltage: 1.32 V

This low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 24

A wider address bus allows the microcontroller to access a larger range of memory locations, enhancing its capabilities.

Bit Size: 32

A 32-bit microcontroller can handle larger data sizes and perform more complex calculations compared to lower bit sizes.

ADC Channels: YES

Having analog-to-digital converters built into the microcontroller allows for easy interfacing with analog sensors and inputs.

ROM Words: 262144

With a large ROM capacity, this microcontroller can store a significant amount of program code for execution.

No. of Timers: 12

Multiple timers provide versatile timing and control capabilities for various applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller architecture offers high performance and efficiency for executing instructions.

Connectivity: CAN(2), ETHERNET, HSMCI, I2C, I2S(2), IRDA, ISI, LIN, MMC, QEI(4)

The wide range of connectivity options enables easy communication and data transfer with other devices or systems.

Technical Specifications

Microcontrollers ATSAME70Q20B-CFNT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B144

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

24

No. of External Interrupts:

3

No. of I/O Lines:

114

No. of Terminals:

144

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,6X16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

RAM Words:

393216

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

.6 mm

Speed:

300 rpm

Maximum Supply Current:

.006 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Connectivity:

CAN(2), ETHERNET, HSMCI, I2C, I2S(2), IRDA, ISI, LIN, MMC, QEI(4)

Peripherals:

BOD, COMPARATOR, DMA(24), POR, PWM(16), RTC, RTT, TIMER(12), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

ATSAME70Q20B-CFNT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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