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ATSAME53J19A-MFT

Microchip Technology

ATSAME53J19A-MFT by Microchip Technology

Microchip ATSAME53J19A-MFT is a 32-bit microcontroller with Cortex-M4F CPU, 196608 RAM bytes, and 16-Ch 12-Bit ADC channels. Ideal for automotive applications, it features CAN, ETHERNET, I2C connectivity and operates at up to 48 MHz clock frequency. With low power mode and integrated cache, it offers high performance in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,294 parts In-Stock

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Chip Stock

USA . 4,833 parts In-Stock

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4,833

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VNN

France . 1,000 parts In-Stock

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1,000

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 482 parts In-Stock

1+ parts

$8.000

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482

$8.000

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AZTECH Wire

Italy . 112 parts In-Stock

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$8.120

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112

$8.120

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Corohmni

South Africa . 27 parts In-Stock

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$8.310

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27

$8.310

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Microchip USA

USA . 5,881 parts In-Stock

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$18.032

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5,881

$18.032

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Semicontronic

India . 618 parts In-Stock

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$31.000

100+ parts

$30.225

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$30.070

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618

$31.000

$30.225

$30.070

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Fulton Briggs Corp.

USA . 4,300 parts In-Stock

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Continental Prestige Electronics

USA . 2,888 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 112 parts In-Stock

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112

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Overview

Unlock a world of possibilities with the Microchip Technology ATSAME53J19A-MFT microcontroller. With its high-quality manufacturing and cutting-edge technology, this device is perfect for a wide range of applications. From automotive to industrial sectors, this microcontroller offers unparalleled value, benefits, and advantages to customers. Experience seamless connectivity, efficient power management, and reliable performance, making it the ideal choice for your next project. Elevate your designs with the ATSAME53J19A-MFT and see the difference for yourself.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache improves data access times and overall performance of the microcontroller.

Maximum Supply Voltage: 3.63 V

The higher maximum supply voltage allows for versatility in power supply options.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to interface with analog components and sensors.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data for processing.

DMA Channels: YES

DMA channels help to offload data transfer tasks from the CPU, improving efficiency and performance.

Peripherals: BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT

The wide range of peripherals available enhances the functionality and versatility of the microcontroller for various applications.

Connectivity: CAN(2), ETHERNET, I2C, LIN, QSPI, USB

The multiple connectivity options make the microcontroller suitable for communication with different devices and interfaces.

Low Power Mode: YES

The low power mode feature helps in conserving energy and extending battery life in battery-operated applications.

Technical Specifications

Microcontrollers ATSAME53J19A-MFT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

16

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

196608

RAM Words:

196608

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; ISO/TS-16949

Maximum Seated Height:

1 mm

Speed:

100 rpm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C, LIN, QSPI, USB

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

ATSAME53J19A-MFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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