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ATSAMD51J18A-AUT-EFP

Microchip Technology

ATSAMD51J18A-AUT-EFP by Microchip Technology

ATSAMD51J18A-AUT-EFP by Microchip: 32-bit Cortex-M4F CPU, 48 MHz clock, 131072 RAM bytes. Ideal for industrial applications requiring CAN, Ethernet, and USB connectivity with low power mode support.

Median Price

$6.049

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$6.049

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Vyrian

USA . 3,440 parts In-Stock

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VNN

France . 2,957 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,612 parts In-Stock

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$5.960

100+ parts

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$5.841

3,612

$5.960

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$5.841

AZTECH Wire

Italy . 594 parts In-Stock

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$17.526

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594

$17.526

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Aztec Data Supply Inc.

USA . 278 parts In-Stock

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$26.640

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278

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Semicontronic

India . 818 parts In-Stock

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$27.000

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$26.325

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$26.190

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818

$27.000

$26.325

$26.190

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$28.164

100+ parts

$26.756

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$26.756

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$28.164

$26.756

$26.756

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Ampacity Inc.

Singapore . 592 parts In-Stock

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$29.000

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Microchip USA

USA . 3,804 parts In-Stock

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$29.850

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$29.660

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$29.570

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$29.480

3,804

$29.850

$29.660

$29.570

$29.480

Corohmni

South Africa . 159 parts In-Stock

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$47.594

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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LOOK Integrated Logistics

Peru . 7,506 parts In-Stock

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NIA Electronics

USA . 6,951 parts In-Stock

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LMD Electronica

Estonia . 2,522 parts In-Stock

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Ledger Components

France . 1,935 parts In-Stock

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Montano Global Distributors

Canada . 1,346 parts In-Stock

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Argo Parts USA

USA . 939 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$5.928

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$5.747

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$5.626

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$5.747

$5.626

Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the ATSAMD51J18A-AUT-EFP microcontroller by Microchip Technology. Designed for industrial-grade applications, this Cortex-M4F CPU family device boasts advanced features like integrated cache, multiple ADC channels, and 32-bit processing power. Perfect for projects that demand precision and efficiency, this microcontroller offers high-speed connectivity options like USB, Ethernet, and more. Say goodbye to compromise and hello to seamless operation with the ATSAMD51J18A-AUT-EFP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable.

Integrated Cache: YES

The integrated cache improves performance by reducing access times to frequently used data.

Surface Mount: YES

The surface mount feature allows for easy and space-efficient PCB assembly.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage provides versatility in power supply options.

On Chip Data RAM Width: 8

The wide on-chip data RAM width allows for efficient data processing.

Screening Level: ISO/TS-16949

The ISO/TS-16949 screening level ensures high quality and reliability of the product.

Package Shape: SQUARE

The square package shape simplifies PCB layout and component placement.

Bit Size: 32

The 32-bit size provides high processing capability for complex applications.

DAC Channels: YES

The presence of DAC channels allows for analog output functionality.

No. of Terminals: 64

The high number of terminals enables connections to various external devices.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

The package style offers space-saving and easy integration on PCBs.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy efficiency in operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environments.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family provides efficient processing power for diverse applications.

No. of External Interrupts: 16

The high number of external interrupts allows for efficient event handling.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and solderability.

ADC Channels: YES

The presence of ADC channels enables analog input conversion for precision measurements.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfers without CPU intervention.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and soldering.

ROM Words: 262144

The large ROM capacity allows for storing extensive program code and data.

Maximum Seated Height: 1.2 mm

The low maximum seated height enables compact device designs.

Digital To Analog Convertors: 2 Ch 12-Bit

The two DAC channels with 12-bit resolution provide high-quality analog output.

RAM Words: 131072

The ample RAM capacity allows for efficient data storage and processing.

Width: 10 mm

The compact 10mm width enables space-saving PCB design.

Peripherals: BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT

The variety of peripherals enhances connectivity and functionality for different applications.

Maximum Clock Frequency: 48 MHz

The high clock frequency ensures fast data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable solder joints during assembly.

Length: 10 mm

The compact 10mm length enables space-efficient PCB designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture provides efficient processing capabilities for various applications.

No. of Timers: 13

The high number of timers allows for precise timekeeping and event scheduling.

RAM Bytes: 131072

The large RAM capacity in bytes enables efficient data storage and processing.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder joints.

Analog To Digital Convertors: 16-Ch 12-Bit

The 16 ADC channels with 12-bit resolution enable precise analog-to-digital conversion.

Maximum Supply Current: 60 mA

The low maximum supply current ensures energy-efficient operation.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent performance.

No. of DMA Channels: 32

The high number of DMA channels enables efficient data transfer operations.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog output signals.

Connectivity: CAN(2), ETHERNET, I2C, LIN, QSPI, USB

The connectivity options enable integration with various communication protocols and devices.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and versatile firmware updates.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density PCB layouts.

Format: FLOATING POINT

The floating-point format provides high precision in mathematical calculations.

Speed: 120 rpm

The high speed capability enables fast data processing and response times.

Low Power Mode: YES

The low power mode option allows for energy-efficient operation in battery-powered devices.

On Chip Program ROM Width: 8

The wide on-chip ROM width enables efficient program storage.

No. of I/O Lines: 51

The high number of I/O lines allows for versatile connectivity and interfacing options.

Technical Specifications

Microcontrollers ATSAMD51J18A-AUT-EFP attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

16

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

131072

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

ISO/TS-16949

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C, LIN, QSPI, USB

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(32), POR, TIMER(13), RTC, WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

ATSAMD51J18A-AUT-EFP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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