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ATSAMD21J17D-MFT

Microchip Technology

ATSAMD21J17D-MFT by Microchip Technology

ATSAMD21J17D-MFT by Microchip: 32-bit Cortex-M0+ CPU, 3.63V max supply, -40 to 125°C temp range. Ideal for automotive applications with ADC/DAC channels, DMA support, and low power mode.

Median Price

$4.250

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

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$4.250

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Vyrian

USA . 4,884 parts In-Stock

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VNN

France . 2,686 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,515 parts In-Stock

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$4.250

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$4.165

4,515

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$4.165

Argo Parts USA

USA . 2,881 parts In-Stock

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$4.250

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Netroflash

USA . 500 parts In-Stock

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$4.250

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500

$4.250

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$4.335

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$4.335

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$4.335

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350

$4.335

$4.335

$4.335

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Ampacity Inc.

Singapore . 151 parts In-Stock

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$13.000

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151

$13.000

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AZTECH Wire

Italy . 332 parts In-Stock

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$16.639

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$16.639

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Corohmni

South Africa . 171 parts In-Stock

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$25.106

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Aztec Data Supply Inc.

USA . 964 parts In-Stock

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$61.872

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964

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QUARKTWIN TECHNOLOGY LTD

USA . 16,029 parts In-Stock

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iodParts Technologies Inc.

India . 14,000 parts In-Stock

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Fulton Briggs Corp.

USA . 1,978 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Unlock the possibilities with the ATSAMD21J17D-MFT microcontroller by Microchip Technology. Designed with top-notch quality and reliability, this powerful device is perfect for a wide range of applications in the automotive industry, IoT devices, and consumer electronics. Experience seamless connectivity, low power consumption, and versatile peripherals that will take your projects to the next level. Trust Microchip Technology and elevate your designs with the ATSAMD21J17D-MFT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to environmental factors, ensuring the longevity of the microcontroller.

Integrated Cache: YES

Integrated cache helps in improving the performance of the microcontroller by storing frequently accessed data, resulting in faster processing speeds.

Maximum Supply Voltage: 3.63 V

Higher maximum supply voltage allows for flexibility in power input options, making it compatible with a wide range of power sources.

Bit Size: 32

32-bit architecture allows for more complex operations and calculations, making the microcontroller suitable for a variety of applications requiring higher precision.

DAC Channels: YES

DAC channels enable the microcontroller to convert digital signals into analog signals, making it ideal for applications that require analog output.

ADC Channels: YES

ADC channels enable the microcontroller to convert analog signals into digital signals, making it suitable for applications that require analog input.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers improved performance, reduced power consumption, and faster execution of instructions, making it a reliable choice for various embedded applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, saving time and effort in updating and debugging the firmware.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers improved performance, reduced power consumption, and faster execution of instructions, making it a reliable choice for various embedded applications.

Technical Specifications

Microcontrollers ATSAMD21J17D-MFT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0+

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Serial I/Os:

1

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Current:

5.8 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

I2S, SERCOM(6), USB

Peripherals:

BOD, COMPARATOR(2), CRC, DMA(12), POR, PWM, RTC, TIMER(9), WDT

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

ATSAMD21J17D-MFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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