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ATSAM4CMP8CC-AUR

Microchip Technology

ATSAM4CMP8CC-AUR by Microchip Technology

Microchip ATSAM4CMP8CC-AUR is a 32-bit microcontroller with Cortex-M4 CPU, 524288 ROM words, and 38912 RAM words. It features 6 ADC channels, 23 DMA channels, and peripherals like BOR, LCD, PWM(3). Ideal for industrial applications requiring low power mode and high clock frequency up to 20 MHz.

Median Price

$12.312

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$12.312

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64

$12.312

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Vyrian

USA . 3,587 parts In-Stock

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3,587

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VNN

France . 1,597 parts In-Stock

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1,597

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 44,587 parts In-Stock

1+ parts

$8.430

100+ parts

$8.219

1k+ parts

$8.177

10k+ parts

-

44,587

$8.430

$8.219

$8.177

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Continental Prestige Electronics

USA . 4,961 parts In-Stock

1+ parts

$12.312

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$12.066

4,961

$12.312

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$12.066

Netroflash

USA . 1,000 parts In-Stock

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$12.312

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-

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$11.696

10k+ parts

$11.450

1,000

$12.312

-

$11.696

$11.450

AZTECH Wire

Italy . 978 parts In-Stock

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$18.380

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978

$18.380

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Microchip USA

USA . 3,903 parts In-Stock

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$27.440

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3,903

$27.440

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Ampacity Inc.

Singapore . 258 parts In-Stock

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$30.000

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258

$30.000

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Corohmni

South Africa . 383 parts In-Stock

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$41.965

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383

$41.965

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Aztec Data Supply Inc.

USA . 4,615 parts In-Stock

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$46.436

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4,615

$46.436

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Modulus Dynamics

Lithuania . 368 parts In-Stock

1+ parts

$65.221

100+ parts

$65.221

1k+ parts

$65.221

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368

$65.221

$65.221

$65.221

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Argo Parts USA

USA . 4,751 parts In-Stock

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Fulton Briggs Corp.

USA . 2,008 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the ATSAM4CMP8CC-AUR microcontroller by Microchip Technology. Designed with precision and expertise, this device offers unparalleled performance and reliability for a wide range of applications. Whether you're working on robotics, IoT devices, or industrial automation, this microcontroller delivers exceptional value with its advanced features and seamless connectivity options. Elevate your projects to new heights with the ATSAM4CMP8CC-AUR and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that can withstand various environmental conditions.

Integrated Cache: YES

Enhances overall performance by reducing memory access times and improving efficiency.

Maximum Supply Voltage: 1.32 V

Allows for stable and efficient operation within specified voltage limits.

CPU Family: CORTEX-M4

Utilizes an advanced ARM architecture for optimized performance and power efficiency.

ADC Channels: YES

Enables the microcontroller to efficiently convert analog signals to digital data for processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for faster processing and lower power consumption.

Maximum Clock Frequency: 20 MHz

Allows for high-speed operation and execution of instructions for faster processing tasks.

Connectivity: SPI(3), TWI(2), UART(2), USART(3)

Offers multiple communication options for connecting with external devices and peripherals.

RAM Bytes: 155648

Provides ample memory storage for data processing and temporary storage of variables.

Speed: 120 rpm

Suitable for applications that require precise speed control and synchronization.

Technical Specifications

Microcontrollers ATSAM4CMP8CC-AUR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

23

No. of I/O Lines:

52

No. of Serial I/Os:

5

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

155648

RAM Words:

38912

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI(3), TWI(2), UART(2), USART(3)

Peripherals:

BOR, DMA(23), LCD, POR, PWM(3), RTC, TIMER(6), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

ATSAM4CMP8CC-AUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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