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ATSAM3S4BA-MUR

Microchip Technology

ATSAM3S4BA-MUR by Microchip Technology

ATSAM3S4BA-MUR by Microchip Technology is a 32-bit microcontroller with 262144 ROM words and 49152 RAM bytes. It features 10-Ch 12-Bit ADC channels, 2-Ch 12-Bit DAC channels, and operates at a max clock frequency of 20 MHz. Ideal for industrial applications requiring low power consumption and various connectivity options like I2C, SPI, UART, and USB.

Median Price

$8.267

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 75 parts In-Stock

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$8.267

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VNN

France . 20,567 parts In-Stock

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Vyrian

USA . 4,725 parts In-Stock

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Bristol Electronics

USA . 25 parts In-Stock

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AZTECH Wire

Italy . 308 parts In-Stock

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$6.222

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Aranea Global

USA . 500 parts In-Stock

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$8.102

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$7.778

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$8.102

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$7.778

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Continental Prestige Electronics

USA . 1,657 parts In-Stock

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$8.267

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$8.267

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$8.102

Ampacity Inc.

Singapore . 971 parts In-Stock

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$11.000

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971

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Corohmni

South Africa . 1,074 parts In-Stock

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$18.757

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Aztec Data Supply Inc.

USA . 2,057 parts In-Stock

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$63.057

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Lixinc

USA . 8,165 parts In-Stock

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Perfect Parts

USA . 7,591 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,343 parts In-Stock

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Argo Parts USA

USA . 1,315 parts In-Stock

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West Coast Incorporated

USA . 991 parts In-Stock

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Overview

Unlock the potential of your projects with the Microchip Technology ATSAM3S4BA-MUR microcontroller. Designed by a trusted manufacturer, this versatile device offers a wide range of applications in various industries. With features such as low power mode, boundary scan, and multiple connectivity options, this product provides unparalleled value and benefits to customers looking for high-performance solutions. Upgrade your designs with the quality and reliability of Microchip Technology's ATSAM3S4BA-MUR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to external elements, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability enables easy and efficient integration of the microcontroller onto circuit boards.

Maximum Supply Voltage: 1.95 V

Higher maximum supply voltage allows for flexibility in power requirements and compatibility with a range of systems.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and enhanced performance.

Package Shape: SQUARE

Square package shape promotes efficient use of space on a PCB and facilitates better heat dissipation.

Bit Size: 32

A 32-bit system enables higher precision and processing capabilities compared to lower bit sizes.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog components and systems.

No. of Terminals: 64

Having a higher number of terminals provides more connectivity options and flexibility in system design.

Minimum Supply Voltage: 1.62 V

Lower minimum supply voltage helps in energy efficiency and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the microcontroller to function reliably in both hot and cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and solderability for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to sample and convert analog signals for processing.

DMA Channels: YES

Direct memory access channels enhance data transfer speed and efficiency between peripherals and memory.

Terminal Position: QUAD

Quad terminal position simplifies the PCB layout and enables easy connection to external components.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program code and data for complex applications.

Maximum Seated Height: 1 mm

Low seated height saves space in compact designs and allows for slim and sleek product form factors.

Digital To Analog Convertors: 2-Ch 12-Bit

Having dual digital-to-analog converters with 12-bit resolution enables high-precision analog output capabilities.

Width: 9 mm

Compact width facilitates integration into tight spaces and dense circuit board layouts.

Boundary Scan: YES

Boundary scan feature aids in testing and debugging the microcontroller during manufacturing and maintenance.

Peripherals: BOD, COMPARATOR, DMA(22), POR, PWM(8), RTC, RTT, TIMER, WDT

A wide range of peripherals provides enhanced functionality and options for interfacing with external devices.

Maximum Clock Frequency: 20 MHz

Higher clock frequency supports fast processing speeds and real-time operations in demanding applications.

Length: 9 mm

Compact length contributes to space-saving design and flexibility in layout arrangements.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Using RISC architecture leads to faster execution of instructions and efficient use of system resources.

RAM Bytes: 49152

Having a large RAM capacity allows for efficient data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various integrated circuits.

Terminal Form: NO LEAD

No-lead terminal form simplifies the manufacturing process and enhances reliability in soldering connections.

Analog To Digital Convertors: 10-Ch 12-Bit

Having ten analog-to-digital converter channels with 12-bit resolution enables precise analog signal conversion.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent performance and compatibility with common power sources.

No. of DMA Channels: 22

A higher number of DMA channels allows for efficient data transfer between peripherals and memory without CPU intervention.

No. of Serial I/Os: 4

Four serial I/Os provide connectivity options for serial communication interfaces, enhancing versatility in system design.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog signals, making the microcontroller suitable for motor control and power management applications.

Connectivity: HSMCI, I2C, I2S, IRDA, SPI, SSC, TWI(2), UART(2), USART(2), USB

A wide range of connectivity options allows for seamless integration with various external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible updating of the microcontroller firmware without the need for special equipment.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm facilitates high-density mounting and provides reliable electrical connections in miniaturized designs.

Format: FIXED POINT

Using fixed-point format simplifies arithmetic operations and improves computational efficiency in signal processing applications.

Speed: 64 rpm

Operating at a speed of 64 rotations per minute (rpm) denotes performance capability and efficiency in executing tasks.

Low Power Mode: YES

Low power mode capability enhances energy efficiency and prolongs battery life in portable and battery-operated devices.

On Chip Program ROM Width: 8

An on-chip program ROM width of 8 contributes to efficient program storage and execution in the microcontroller.

No. of I/O Lines: 47

Having 47 I/O lines provides ample connectivity options for interfacing with external peripherals and sensors, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers ATSAM3S4BA-MUR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

22

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

49152

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

64 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

HSMCI, I2C, I2S, IRDA, SPI, SSC, TWI(2), UART(2), USART(2), USB

Peripherals:

BOD, COMPARATOR, DMA(22), POR, PWM(8), RTC, RTT, TIMER, WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

ATSAM3S4BA-MUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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