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AT28C010-12JU-235

Microchip Technology

AT28C010-12JU-235 by Microchip Technology

AT28C010-12JU-235 by Microchip is a 128Kx8 EEPROM with 120ns access time, operating at -40 to 85°C. It has a 32-terminal Gull Wing package and supports asynchronous mode. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact form factor.

Median Price

$41.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 727 parts In-Stock

1+ parts

$41.100

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727

$41.100

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Nova Conductors

Japan . 16 parts In-Stock

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$34.665

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16

$34.665

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Vyrian

USA . 9,115 parts In-Stock

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VNN

France . 4,194 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 765 parts In-Stock

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$3.860

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765

$3.860

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AZTECH Wire

Italy . 604 parts In-Stock

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$6.296

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604

$6.296

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Semicontronic

India . 466 parts In-Stock

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$32.130

100+ parts

$31.327

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$31.166

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466

$32.130

$31.327

$31.166

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Ampacity Inc.

Singapore . 355 parts In-Stock

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$32.130

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355

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Aranea Global

USA . 100 parts In-Stock

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$33.972

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$32.613

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100

$33.972

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Corohmni

South Africa . 117 parts In-Stock

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$34.665

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117

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Continental Prestige Electronics

USA . 483 parts In-Stock

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$34.665

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$33.972

483

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$33.972

QualityLine Systems

Poland . 7,550 parts In-Stock

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XL Components Corporation

Australia . 3,157 parts In-Stock

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Microchip USA

USA . 1,031 parts In-Stock

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Argo Parts USA

USA . 470 parts In-Stock

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Marpe Global Electronics

Taiwan . 405 parts In-Stock

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Overview

Unlock the power of reliable data storage with the AT28C010-12JU-235 by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers top-notch quality and innovation in every product. The AT28C010-12JU-235 belongs to the EEPROM category, offering unparalleled advantages for various applications. With its small outline package style and industrial temperature grade, this EEPROM ensures durability and efficiency. Experience seamless operations and fast access times with the AT28C010-12JU-235, providing unmatched value and benefits to customers looking for high-performance memory solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the EEPROM chip, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, making installation convenient and efficient.

Operating Mode: ASYNCHRONOUS

Enables independent operation without the need for synchronization, enhancing flexibility in various applications.

Nominal Supply Voltage / Vsup (V): 5

Provides stable power supply for optimal performance of the EEPROM chip.

Memory Density: 1048576 bit

Offers ample storage capacity for data, allowing for versatile use in different electronic devices.

Maximum Access Time: 120 ns

Ensures fast and efficient data retrieval, enhancing overall performance of the product.

Technology: CMOS

Utilizes low power consumption and high noise immunity for efficient operation and reliability.

Technical Specifications

EEPROM AT28C010-12JU-235 attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Access Time:

120 ns

JESD-30 Code:

R-PDSO-G32

Length:

13.97 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Programming Voltage (V):

5

Maximum Seated Height:

3.556 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

11.43 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

AT28C010-12JU-235 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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