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24LC256T-I/MF

Microchip Technology

24LC256T-I/MF by Microchip Technology

24LC256T-I/MF by Microchip Technology is an EEPROM with 32KX8 organization, operating at 4.5V, and featuring I2C control byte 1010DDDR. It has a memory density of 262144 bit, endurance of 1M cycles, and operates in industrial temperature range. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.

Median Price

$1.340

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 7,730 parts In-Stock

1+ parts

$1.340

100+ parts

$1.250

1k+ parts

$1.170

10k+ parts

$1.110

7,730

$1.340

$1.250

$1.170

$1.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 6,600 parts In-Stock

1+ parts

$1.540

100+ parts

$1.390

1k+ parts

$1.250

10k+ parts

-

6,600

$1.540

$1.390

$1.250

-

Vyrian

USA . 8,463 parts In-Stock

1+ parts

-

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8,463

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VNN

France . 25 parts In-Stock

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25

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Nova Conductors

Japan . 22 parts In-Stock

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22

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 14,939 parts In-Stock

1+ parts

$1.140

100+ parts

$1.112

1k+ parts

$1.106

10k+ parts

-

14,939

$1.140

$1.112

$1.106

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Aztec Data Supply Inc.

USA . 295 parts In-Stock

1+ parts

$2.010

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-

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295

$2.010

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Corohmni

South Africa . 538 parts In-Stock

1+ parts

$3.028

100+ parts

-

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538

$3.028

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AZTECH Wire

Italy . 688 parts In-Stock

1+ parts

$15.560

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688

$15.560

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West Coast Incorporated

USA . 6,302 parts In-Stock

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6,302

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Continental Prestige Electronics

USA . 3,816 parts In-Stock

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3,816

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Argo Parts USA

USA . 3,738 parts In-Stock

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3,738

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Bastille Electronics

Australia . 870 parts In-Stock

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870

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Overview

Unlock the power of reliable data storage with the 24LC256T-I/MF EEPROM by Microchip Technology. Designed with precision and quality in mind, this versatile chip offers endless possibilities for applications in various industries. From automotive to consumer electronics, its compact design and high endurance ensure seamless performance. Let Microchip Technology elevate your projects with cutting-edge technology that guarantees efficiency and durability. Say hello to a new era of innovation with the 24LC256T-I/MF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the EEPROM, making it suitable for various environments.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient data transfers and improved performance of the EEPROM.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5V ensures stable operation of the EEPROM within a specified range, enhancing overall reliability.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this EEPROM can function effectively in harsh industrial environments.

Memory Density: 262144 bit

High memory density allows for storage of a large amount of data in this EEPROM, making it suitable for applications requiring extensive data storage.

Endurance: 1000000 Write/Erase Cycles

High endurance rating ensures long-term reliability and data integrity, making this EEPROM a durable storage solution.

Serial Bus Type: I2C

I2C serial bus type offers a convenient interface for communication with other devices, enhancing versatility and connectivity of the EEPROM.

Technical Specifications

EEPROM 24LC256T-I/MF attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

6 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Programming Voltage (V):

4.5

Qualification:

Not Qualified

Reverse Pinout:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC256T-I/MF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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