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24LC256-E/MF

Microchip Technology

24LC256-E/MF by Microchip Technology

24LC256-E/MF by Microchip Technology is an EEPROM with 32KX8 organization, operating at 4.5V, and featuring I2C serial bus type. Ideal for automotive applications due to AEC-Q100 screening level, it offers 1mm seated height and 1000000 write/erase cycles endurance.

Median Price

$1.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 202 parts In-Stock

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$1.500

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Nova Conductors

Japan . 98 parts In-Stock

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$1.529

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Vyrian

USA . 3,637 parts In-Stock

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VNN

France . 813 parts In-Stock

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Ampacity Inc.

Singapore . 202 parts In-Stock

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$1.200

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Continental Prestige Electronics

USA . 4,405 parts In-Stock

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$1.529

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$1.498

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Argo Parts USA

USA . 1,613 parts In-Stock

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$1.529

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Netroflash

USA . 100 parts In-Stock

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$1.529

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Aztec Data Supply Inc.

USA . 249 parts In-Stock

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$2.297

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Corohmni

South Africa . 156 parts In-Stock

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$4.733

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Microchip USA

USA . 1,297 parts In-Stock

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$8.991

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AZTECH Wire

Italy . 358 parts In-Stock

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$9.234

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LMD Electronica

Estonia . 7,510 parts In-Stock

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NIA Electronics

USA . 5,219 parts In-Stock

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LOOK Integrated Logistics

Peru . 2,779 parts In-Stock

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Montano Global Distributors

Canada . 2,129 parts In-Stock

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Ledger Components

France . 1,363 parts In-Stock

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Overview

Elevate your electronic projects with the 24LC256-E/MF EEPROM from Microchip Technology. Renowned for their superior quality, Microchip offers reliable components that exceed expectations in various applications. This small outline memory chip provides 32Kx8 organization, 1000000 write/erase cycles endurance, and operates at a maximum clock frequency of 0.4 MHz. With its automotive-grade temperature rating, hardware write protection, and I2C serial bus interface, this EEPROM guarantees optimal performance and longevity for your designs. Experience unparalleled value and efficiency with the 24LC256-E/MF and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it a reliable choice.

Surface Mount: YES

The surface mount option allows for easy and convenient installation of the EEPROM onto a circuit board.

Screening Level: AEC-Q100

A high screening level ensures the EEPROM meets automotive quality standards, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate the EEPROM into various electronic devices.

Operating Mode: SYNCHRONOUS

The synchronous operation allows for efficient communication and data transfer within the EEPROM.

Nominal Supply Voltage (Vsup): 4.5V

The 4.5V supply voltage ensures optimal performance and reliability of the EEPROM.

Power Supplies (V): 3/5

The dual power supply options of 3V and 5V make the EEPROM versatile and compatible with different systems.

No. of Terminals: 8

With 8 terminals, this EEPROM can easily connect to other components in a circuit, providing flexibility in design.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers a compact and efficient design for space-constrained applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the EEPROM can withstand harsh environmental conditions.

Organization: 32KX8

The 32KX8 organization provides ample memory capacity for storing data in the EEPROM.

Output Characteristics: OPEN-DRAIN

The open-drain output allows for easy interfacing with other components in the circuit.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this EEPROM suitable for use in a wide range of environments.

Terminal Finish: MATTE TIN

The matte tin finish provides a reliable and stable connection for the terminals of the EEPROM.

I2C Control Byte: 1010DDDR

The I2C control byte format allows for easy and efficient control of the EEPROM through the I2C bus.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting and connecting the EEPROM in a circuit.

Write Protection: HARDWARE

The hardware write protection feature ensures data integrity and prevents accidental writing to the EEPROM.

Maximum Seated Height: 1 mm

The low seated height of 1mm makes this EEPROM suitable for compact electronic devices.

Maximum Clock Frequency (fCLK): 0.4 MHz

The high clock frequency allows for fast data transfer and processing within the EEPROM.

Width: 5 mm

The compact width of 5mm makes this EEPROM suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.5V

The low minimum supply voltage ensures the EEPROM can operate efficiently even in low-power systems.

Maximum Time At Peak Reflow Temperature: 40s

The EEPROM can withstand peak reflow temperatures for up to 40 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature: 260C

The high peak reflow temperature of 260C ensures proper soldering and assembly of the EEPROM onto a circuit board.

Length: 6 mm

The length of 6mm provides a compact footprint for the EEPROM, making it suitable for small electronic devices.

Programming Voltage (V): 4.5V

The 4.5V programming voltage ensures accurate and reliable programming of data into the EEPROM.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures the EEPROM can withstand extreme temperature variations, making it ideal for automotive applications.

Technology: CMOS

The CMOS technology used in the EEPROM offers low power consumption and high speed performance.

Parallel or Serial: SERIAL

The serial interface allows for easy communication and data transfer with other components in the circuit.

Terminal Form: NO LEAD

The no-lead terminal form offers a reliable and durable connection for the EEPROM.

Maximum Supply Current: 3 mA

The low maximum supply current of 3mA ensures efficient power consumption by the EEPROM.

No. of Words: 32768 words

With 32768 words of memory, this EEPROM can store a large amount of data reliably.

Memory Width: 8

The memory width of 8 bits allows for efficient storage and retrieval of data within the EEPROM.

Minimum Data Retention Time: 200

The minimum data retention time of 200 years ensures long-term reliability of stored data in the EEPROM.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm provides easy and secure connections for the EEPROM in a circuit.

No. of Words Code: 32K

The 32K words code indicates the memory capacity of the EEPROM, making it suitable for various data storage applications.

Maximum Supply Voltage (Vsup): 5.5V

The high maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1000000 write/erase cycles ensures the longevity and durability of the EEPROM.

Serial Bus Type: I2C

The I2C serial bus type allows for easy integration and communication with other devices in the circuit.

Maximum Write Cycle Time (tWC): 5 ms

The fast maximum write cycle time of 5ms ensures quick and efficient data writing to the EEPROM.

Memory Density: 262144 bit

With a memory density of 262144 bits, this EEPROM offers ample storage capacity for various data types.

Memory IC Type: EEPROM

The EEPROM memory IC type offers reliable non-volatile storage for data critical applications.

Maximum Standby Current: 0.000005 Amp

The low maximum standby current of 0.000005 Amp ensures minimal power consumption when the EEPROM is not in use.

Technical Specifications

EEPROM 24LC256-E/MF attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

6 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Programming Voltage (V):

4.5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC256-E/MF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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