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24LC16B-E/ST

Microchip Technology

24LC16B-E/ST by Microchip Technology

24LC16B-E/ST by Microchip Tech is a 2Kx8 EEPROM with 1000000 Write/Erase Cycles. Operating at -40 to 125 °C, it has a Serial I2C interface and supports up to 0.4 MHz clock frequency. Ideal for automotive applications due to AEC-Q100 screening level.

Median Price

$0.600

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 895 parts In-Stock

1+ parts

$0.600

100+ parts

$0.509

1k+ parts

$0.505

10k+ parts

$0.497

895

$0.600

$0.509

$0.505

$0.497

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,924 parts In-Stock

1+ parts

-

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-

1k+ parts

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7,924

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VNN

France . 3,334 parts In-Stock

1+ parts

-

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3,334

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

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1k+ parts

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300

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 641 parts In-Stock

1+ parts

$0.425

100+ parts

-

1k+ parts

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10k+ parts

-

641

$0.425

-

-

-

Corohmni

South Africa . 53 parts In-Stock

1+ parts

$2.736

100+ parts

-

1k+ parts

-

10k+ parts

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53

$2.736

-

-

-

Microchip USA

USA . 1,906 parts In-Stock

1+ parts

$3.112

100+ parts

-

1k+ parts

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10k+ parts

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1,906

$3.112

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LOOK Integrated Logistics

Peru . 8,270 parts In-Stock

1+ parts

-

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8,270

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LMD Electronica

Estonia . 6,946 parts In-Stock

1+ parts

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6,946

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NIA Electronics

USA . 6,849 parts In-Stock

1+ parts

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6,849

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Montano Global Distributors

Canada . 6,286 parts In-Stock

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6,286

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Ledger Components

France . 3,841 parts In-Stock

1+ parts

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3,841

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,000

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Overview

Unlock endless possibilities with the 24LC16B-E/ST EEPROM by Microchip Technology. Crafted with precision and reliability, this small yet powerful memory device offers a seamless solution for your automotive applications. Experience the convenience of hardware write protection, superior endurance with 1,000,000 write/erase cycles, and a compact design that fits seamlessly into your projects. Trust in Microchip's proven track record of delivering high-quality components, and elevate your designs with the 24LC16B-E/ST. Elevate your projects with the 24LC16B-E/ST today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and reliable packaging for the EEPROM, ensuring long-term performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive applications where heat resistance is crucial.

Memory Density: 16384 bit

Offers a high memory density, allowing for the storage of a large amount of data in a compact form.

Endurance: 1000000 Write/Erase Cycles

Withstands a high number of write/erase cycles, ensuring longevity and reliability in data storage operations.

Serial Bus Type: I2C

Utilizes the widely-used I2C communication protocol, enabling easy integration and compatibility with a variety of systems.

Technical Specifications

EEPROM 24LC16B-E/ST attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010MMMR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Programming Voltage (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

24LC16B-E/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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