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24LC02BTE/OT16KVAO

Microchip Technology

24LC02BTE/OT16KVAO by Microchip Technology

24LC02BTE/OT16KVAO by Microchip Technology is a 256x8 EEPROM with 2048-bit memory density. Operating at 5V, it has a clock frequency of 0.4 MHz and supports I2C serial bus type. Ideal for automotive applications due to AEC-Q100 screening level and -40 to 125°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,050 parts In-Stock

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4,050

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VNN

France . 2,202 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 50,591 parts In-Stock

1+ parts

$0.348

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$0.348

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Semicontronic

India . 32,532 parts In-Stock

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$0.348

100+ parts

$0.339

1k+ parts

$0.338

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32,532

$0.348

$0.339

$0.338

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Corohmni

South Africa . 878 parts In-Stock

1+ parts

$4.014

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878

$4.014

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AZTECH Wire

Italy . 1,011 parts In-Stock

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$9.880

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1,011

$9.880

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Continental Prestige Electronics

USA . 6,032 parts In-Stock

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6,032

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Fulton Briggs Corp.

USA . 2,176 parts In-Stock

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Argo Parts USA

USA . 1,448 parts In-Stock

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Microchip USA

USA . 1,116 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Unlock the power of reliable data storage with the 24LC02BTE/OT16KVAO by Microchip Technology. As a leader in EEPROM technology, Microchip delivers unmatched quality and durability, making this product ideal for automotive applications. With a compact design, low profile package, and wide operating temperature range, this EEPROM offers seamless integration and long-lasting performance. Trust Microchip to provide the innovative solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM, making it suitable for various environments.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is processed efficiently and accurately, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

A common and stable supply voltage that ensures reliable and consistent operation of the EEPROM.

Organization: 256X8

This organization provides a good balance between memory capacity and data width, suitable for various applications.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive operating conditions, making it a reliable choice for automotive applications.

Serial Bus Type: I2C

I2C serial bus communication offers simple interfacing with other devices, enhancing system integration and flexibility.

Memory Density: 2048 bit

Sufficient memory density for storing data, configurations, and settings in embedded systems and IoT devices.

Memory IC Type: EEPROM

Specifically designed for non-volatile data storage, making it a suitable choice for applications requiring persistent memory.

Technical Specifications

EEPROM 24LC02BTE/OT16KVAO attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

5

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.45 mm

Serial Bus Type:

I2C

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

24LC02BTE/OT16KVAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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