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24C01C-I/MS

Microchip Technology

24C01C-I/MS by Microchip Technology

24C01C-I/MS by Microchip Technology is an EEPROM with 128x8 organization, operating at 5V. It features I2C control byte 1010DDDR and offers a memory density of 1024 bit. Ideal for industrial applications requiring reliable data storage with endurance of 1M write/erase cycles.

Median Price

$0.440

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 96 parts In-Stock

1+ parts

$0.440

100+ parts

$0.394

1k+ parts

-

10k+ parts

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96

$0.440

$0.394

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,371

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-

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TME

Poland . 21 parts In-Stock

1+ parts

-

100+ parts

$0.390

1k+ parts

-

10k+ parts

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21

-

$0.390

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RGB Technical Solutions

Ukraine . 3,706 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,706

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Perfect Parts

USA . 1,729 parts In-Stock

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10k+ parts

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1,729

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Overview

Unlock the power of data storage with the 24C01C-I/MS EEPROM by Microchip Technology. Crafted with precision and reliability in mind, this versatile memory chip offers endless opportunities for applications in various industries. Seamlessly integrating into your projects, this EEPROM delivers unparalleled performance, durability, and security. Say goodbye to data loss worries with its impressive endurance of 1,000,000 write/erase cycles. Trust in the quality of Microchip Technology and experience the value this product brings to your designs. Elevate your technology solutions with the 24C01C-I/MS EEPROM today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that protects the internal components of the EEPROM.

Surface Mount: YES

Allows for easy installation on circuit boards.

Screening Level: TS 16949

Ensures high quality and reliability of the product.

Operating Mode: SYNCHRONOUS

Provides efficient data transfer and operation.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage for many electronic systems, compatible with various setups.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments.

Organization: 128X8

Offers a good balance of storage capacity and access speed.

Memory IC Type: EEPROM

Non-volatile memory technology for reliable data storage.

Technical Specifications

EEPROM 24C01C-I/MS attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Maximum Write Cycle Time (tWC):

1 ms

Trade Compliance

24C01C-I/MS Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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