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24C01C-E/SN

Microchip Technology

24C01C-E/SN by Microchip Technology

24C01C-E/SN by Microchip Technology is an EEPROM with 128x8 organization, operating at 5V. It features I2C control byte 1010DDDR and endurance of 1M write/erase cycles. Ideal for automotive applications due to its TS16949 screening level and small outline package style.

Median Price

$0.445

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,600 parts In-Stock

1+ parts

$0.430

100+ parts

$0.410

1k+ parts

$0.370

10k+ parts

$0.350

2,600

$0.430

$0.410

$0.370

$0.350

Mouser Electronics

USA . 478 parts In-Stock

1+ parts

$0.460

100+ parts

$0.436

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478

$0.460

$0.436

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 2,100 parts In-Stock

1+ parts

$0.450

100+ parts

$0.400

1k+ parts

$0.360

10k+ parts

-

2,100

$0.450

$0.400

$0.360

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Vyrian

USA . 8,399 parts In-Stock

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8,399

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Distributors (Availability)

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QUARKTWIN TECHNOLOGY LTD

USA . 28,974 parts In-Stock

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28,974

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Marpe Global Electronics

Taiwan . 6,868 parts In-Stock

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6,868

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QualityLine Systems

Poland . 6,868 parts In-Stock

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6,868

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XL Components Corporation

Australia . 6,868 parts In-Stock

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6,868

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Microchip USA

USA . 5,791 parts In-Stock

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5,791

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Glotronic Ltd.

UK . 2,500 parts In-Stock

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2,500

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Perfect Parts

USA . 493 parts In-Stock

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493

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Overview

Unlock a world of reliable data storage with the 24C01C-E/SN EEPROM by Microchip Technology. This high-quality memory IC offers unparalleled endurance with 1,000,000 write/erase cycles, ensuring your data is safe and secure. Ideal for automotive applications, this small-outline package boasts a wide operating temperature range from -40°C to 125°C, making it perfect for harsh environments. With its I2C serial bus type and open-drain output characteristics, the 24C01C-E/SN provides seamless integration and efficient data transfer. Trust in Microchip Technology's expertise and experience in producing top-notch electronic components, and elevate your projects with the unmatched performance of the 24C01C-E/SN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM, making it suitable for various environmental conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient data transfer and processing, enhancing the overall performance of the EEPROM.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures reliable and consistent operation of the EEPROM.

Organization: 128X8

With an organization of 128X8, this EEPROM offers a total of 1024 bits of memory storage, suitable for various applications.

No. of Words: 128 words

With 128 words of memory, this EEPROM can store and retrieve a significant amount of data efficiently.

Memory IC Type: EEPROM

Being an EEPROM, this memory IC allows for non-volatile data storage, ensuring data retention even when power is disconnected.

Technical Specifications

EEPROM 24C01C-E/SN attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

1.5 ms

Trade Compliance

24C01C-E/SN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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