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MAX6328XR29-T

Maxim Integrated

MAX6328XR29-T by Maxim Integrated

MAX6328XR29-T by Maxim Integrated is a power management IC with a nominal voltage of 3V. It has a small outline, thin profile package style and operates in industrial temperature range. This IC is suitable for power supply support circuit applications.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,822 parts In-Stock

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Digiode

USA . 1,829 parts In-Stock

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Anansix

USA . 1,162 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Semicontronic

India . 477 parts In-Stock

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$0.500

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$0.488

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$0.485

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477

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 801 parts In-Stock

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$2.500

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801

$2.500

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MARBEL Systems

Belgium . 138 parts In-Stock

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$3.420

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$3.420

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Texas Native Microelectronics

USA . 50 parts In-Stock

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$3.931

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$3.774

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$3.656

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$3.459

50

$3.931

$3.774

$3.656

$3.459

Kenton Components

USA . 917 parts In-Stock

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$4.717

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$4.151

917

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Ampacity Inc.

Singapore . 648 parts In-Stock

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$6.500

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Qasali Group International

UK . 1,851 parts In-Stock

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$10.614

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$9.871

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$9.340

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AZTECH Wire

Italy . 709 parts In-Stock

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$12.579

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Corohmni

South Africa . 47 parts In-Stock

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Argo Parts USA

USA . 2,377 parts In-Stock

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Continental Prestige Electronics

USA . 1,691 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Discover the MAX6328XR29-T, a top-quality Power Management IC from Maxim Integrated. Known for their reliable and innovative technology, Maxim Integrated continues to deliver exceptional products in the field of power management. This versatile IC offers a multitude of applications, making it an essential component for various electronic devices. With its small outline and thin profile package, it provides convenience and efficiency without compromising on performance. Designed for industrial use, this product operates flawlessly in a wide temperature range, ensuring durability and reliability even in harsh conditions. Experience the value, benefits, and advantages that the MAX6328XR29-T brings to your projects, backed by Maxim Integrated's commitment to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures lightweight and cost-effective production, making this power management IC a practical choice.

Surface Mount: YES

The surface mount capability of this IC simplifies the assembly process and enhances its compatibility with modern electronics manufacturing, making it highly convenient to use.

No. of Functions: 1

With a single function, this power management IC is straightforward and focused, ensuring efficient and reliable performance in its designated function.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into various circuit boards and designs, allowing for flexible and versatile application options for this IC.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3V ensures compatibility with a wide range of devices and systems, providing effective power management within this voltage range.

Power Supplies (V): 1.2/5.5

This power management IC supports power supplies ranging from 1.2V to 5.5V, accommodating diverse voltage requirements and making it compatible with a broad range of applications.

No. of Terminals: 3

With only 3 terminals, this IC simplifies circuit connection and reduces complexity, offering ease of integration and improved overall system reliability.

Package Style (Meter): SMALL OUTLINE, THlN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch of this package style contribute to space-saving designs and efficient utilization of board real estate, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand harsh operating conditions without compromising its performance, ensuring reliable operation in demanding environments.

Minimum Operating Temperature: -40 °C

The IC's minimum operating temperature of -40°C enables reliable functionality in extreme cold conditions, further expanding its application scope and versatility.

Terminal Finish: TIN LEAD

The tin lead terminal finish enhances solderability and protects against oxidation, ensuring secure and stable connections, thus contributing to the longevity and reliability of the device.

Terminal Position: DUAL

The dual terminal position simplifies device positioning during assembly and enhances electrical connectivity, promoting efficient and seamless integration within the overall system.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1mm, this IC remains low-profile within the circuit, enabling compact and space-saving designs, particularly suitable for slim and lightweight devices.

Width (mm): 1.25 mm

The IC's small width of 1.25mm enables integration into applications with tight space constraints, allowing for compact and sleek designs without sacrificing functionality.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC is specifically designed as a power supply support circuit, providing reliable and efficient power management functions that contribute to stable and optimized power supply performance in electronic systems.

Minimum Supply Voltage (Vsup): 1.2 V

With a minimum supply voltage of 1.2V, this IC can efficiently operate at lower power levels, maximizing energy efficiency and minimizing power consumption for improved overall system performance.

Length: 2 mm

The IC's compact length of 2mm contributes to its space-saving design, allowing for integration into smaller electronic devices without compromising functionality.

Nominal Threshold Voltage (V): +2.9V

The nominal threshold voltage of +2.9V ensures accurate and reliable switching behavior, providing precise control over specific functions within compatible systems.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating signifies that this IC is designed to operate reliably across a wide range of temperatures, making it suitable for industrial applications and rugged environments.

Maximum Supply Current (Isup): 0.00175 mA

With a maximum supply current of only 0.00175mA, this IC exhibits low power consumption, contributing to energy efficiency and prolonged battery life in portable applications.

No. of Channels: 1

This IC features a single channel, simplifying circuit design and providing a dedicated pathway for power management, ensuring efficient and precise operation within the designated channel.

Technology: CMOS

The use of complementary metal-oxide-semiconductor (CMOS) technology in this IC offers numerous advantages, including low power consumption, high noise immunity, and compatibility with a wide range of digital circuits.

Terminal Form: GULL WING

The gull wing terminal form simplifies surface mount soldering and ensures secure mechanical connections, enhancing the overall robustness and longevity of this power management IC.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this IC allows for higher circuit density on the PCB, enabling more compact designs and greater integration flexibility.

Moisture Sensitivity Level (MSL): 1

Being moisture sensitivity level 1, this IC is highly resistant to moisture-related issues and can be safely subjected to various environmental conditions, ensuring long-term reliability and durability.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this IC can withstand higher voltage inputs, providing versatility and compatibility with a wide range of power supply sources.

Technical Specifications

Power Management ICs MAX6328XR29-T attributes and parameters. Explore more Power Management ICs devices from Maxim Integrated

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.2/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.00175 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.9V

Width (mm):

1.25 mm

Trade Compliance

MAX6328XR29-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Maxim Integrated

Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.

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Management team

President & CEO

Tunc Doluca

Senior VP & CFO

Brian C. White

Senior VP, Technology & Manufacturing Group

Vivek Jain

Manufacturer fab locations 3

Fab name Location Fab Initiation Wafer Capacity

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Fabrication

Fab Initiation

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Philippines

Cavite

Wafer Capacity

489,000

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489,000

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Fabrication

Fab Initiation

-

USA

Beaverton

Wafer Capacity

312,000

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312,000

-

Fabrication

Fab Initiation

-

Thailand

Chon Buri

Wafer Capacity

194,000

-

194,000

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