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MAX514BCNG

Maxim Integrated

MAX514BCNG by Maxim Integrated

D/A CONVERTER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Digiode

USA . 2,023 parts In-Stock

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Anansix

USA . 1,161 parts In-Stock

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Vyrian

USA . 855 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 7 parts In-Stock

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J2 Sourcing AB

Sweden . 4 parts In-Stock

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

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Electronic Treasures

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One Stop Electronics

USA . 190 parts In-Stock

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MARBEL Systems

Belgium . 802 parts In-Stock

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AZTECH Wire

Italy . 450 parts In-Stock

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$16.260

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Texas Native Microelectronics

USA . 300 parts In-Stock

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$15.838

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Kenton Components

USA . 5,725 parts In-Stock

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Semicontronic

India . 181 parts In-Stock

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Qasali Group International

UK . 39 parts In-Stock

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Component Stockers USA

USA . 416 parts In-Stock

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Microchip USA

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Glotronic Ltd.

UK . 2,117 parts In-Stock

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Vigor

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Perfect Parts

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Corphita

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Technical Specifications

Digital-to-Analog Converters MAX514BCNG attributes and parameters. Explore more Digital-to-Analog Converters devices from Maxim Integrated

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.02441 %

Nominal Settling Time (tstl):

250 ns

Maximum Supply Current:

50 mA

Maximum Settling Time:

1 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

240 °C (464 °F)

Maximum Time At Peak Reflow Temperature:

20 s

Form Factor

No. of Terminals:

24

Terminal Form:

Terminal Position:

Dual

Terminal Finish:

Tin Lead

Surface Mount:

No

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

Trade Compliance

MAX514BCNG Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Maxim Integrated

Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President & CEO

Tunc Doluca

Senior VP & CFO

Brian C. White

Senior VP, Technology & Manufacturing Group

Vivek Jain

Manufacturer fab locations 3

Fab name Location Fab Initiation Wafer Capacity

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Fabrication

Fab Initiation

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Philippines

Cavite

Wafer Capacity

489,000

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489,000

-

Fabrication

Fab Initiation

-

USA

Beaverton

Wafer Capacity

312,000

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312,000

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Fabrication

Fab Initiation

-

Thailand

Chon Buri

Wafer Capacity

194,000

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194,000

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