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TPS703

Marktech Optoelectronics

TPS703 by Marktech Optoelectronics

PIN PHOTODIODE; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -30 Cel; Maximum Dark Current: 30 nA; Maximum Operating Temperature: 80 Cel; Semiconductor Material: Silicon;

Median Price

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Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Speed Components Ltd

Israel . 70 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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70

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kepictronics

USA . 8,000 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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8,000

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Technical Specifications

Photodiodes TPS703 attributes and parameters. Explore more Photodiodes devices from Marktech Optoelectronics

Specs

Maximum Dark Current:

30 nA

Mounting Feature:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Optoelectronic Type:

Maximum Response Time:

.0000001 s

Maximum Reverse Voltage:

20 V

Semiconductor Material:

Silicon

Sub-Category:

Photo Diodes

Manufacturer Highlights

Marktech Optoelectronics

Founded in 1985, the privately held, Marktech Optoelectronics is a well-established world-class provider of detector and emitter engineering, design, manufacturing, packaging, burn-in testing, and sorting with production facilities in the USA and Japan. Marktech’s founding members leveraged their deep knowledge of industrial markets and the technical needs of design engineers to rapidly grow and expand into many industries requiring advanced photonics devices. Today, Marktech Optoelectronics is one of the world’s leading manufacturers of UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters and photodiode detectors. The company also engineers and manufactures materials such as silicon photodetector wafers, chips, and InP epiwafers. In the infrared wavelength ranges, Marktech is a vertically integrated manufacturer growing epitaxy InP wafers, fabricating InGaAs detector and emitter chips, packaging chips, and even producing completed assemblies for some OEM customers. Marktech has leading-edge packaging capabilities with the ability to package die in molded plastic through-hole, SMD, chip-scale, TO can, chip on board (COB), and their proprietary seam-welded hermetic ATLAS package. Marktech’s advanced packaging capabilities can produce multiple die components including designs with multi-wavelength emitters, multiple detectors for broadband detection, and emitter-detector combinations.

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